SCHEMBL2201112

SCHEMBL2201112

Cc1cc(C)c(C(c2ccc(O)c(O)c2)c2c(C)cc(C)c(C)c2O)c(O)c1C

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 8/20 0.40
RECQL P46063 7/20 0.40
KDM4E B2RXH2 7/20 0.40
MAPT P10636 7/20 0.40
KMT2A Q03164 5/20 0.40
APEX1 P27695 4/20 0.40
BLM P54132 4/20 0.40
LMNA P02545 3/20 0.40
TSHR P16473 2/20 0.40
HIF1A Q16665 2/20 0.40
HSD17B10 Q99714 2/20 0.40
MTOR P42345 2/20 0.40
ALOX15 P16050 1/20 0.40
NFKB1 P19838 1/20 0.40
THPO P40225 1/20 0.40
POLB P06746 1/20 0.40
SHBG P04278 1/20 0.39
TRPA1 O75762 1/20 0.39
PTGS1 P23219 1/20 0.39
CACNA1C Q13936 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3865902 0.83 GAA (0.47) TDP1KDM4EMAPTKMT2AALOX15
SCHEMBL2203936 0.83 GAA (0.54) MAPTKMT2ABLMTSHRNFKB1
SCHEMBL30375493 0.83 GAA (0.54) MAPTKMT2ABLMTSHRNFKB1
SCHEMBL2202882 0.82 ESR1 (0.39) TDP1MAPTLMNAALOX15TRPA1
SCHEMBL9009311 0.80 TDP1 (0.43) TDP1RECQLKDM4EMAPTKMT2A
SCHEMBL2203238 0.79 GAA (0.58) MAPTKMT2ALMNATSHRMEN1
SCHEMBL2307444 0.78 ALDH1A1 (0.44) KDM4EKMT2ABLMLMNATSHR
SCHEMBL2201624 0.77 TRPA1 (0.47) TDP1RECQLKDM4EMAPTKMT2A
SCHEMBL36227 0.74 TDP1 (0.44) TDP1RECQLKDM4EMAPTKMT2A
SCHEMBL29373036 0.74 TDP1 (0.44) TDP1RECQLKDM4EMAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
CN-113785023-B Water-based ink composition for reversible thermochromic writing instrument, refill for refill and water-based ballpoint pen incorporating same 株式会社百乐 2023-05-12 CN disclosed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2018-01-11 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
US-9633848-B2 Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-04-25 US disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US disclosed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US disclosed
EP-1146394-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION CLARIANT INTERNATIONAL LTD. (CH) 2001-10-17 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME EED, RPL19, RARA TDP1 2239/4885RECQL 740/4885KDM4E 1157/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA TDP1 2239/4885RECQL 740/4885KDM4E 1157/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.