SCHEMBL2201494

SCHEMBL2201494

COc1cc(C(c2ccc(O)c(C(C)C)c2)c2ccc(O)c(C(C)C)c2)ccc1O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.53
CYP3A4 P08684 1/20 0.53
BLM P54132 2/20 0.51
NFKB1 P19838 1/20 0.51
NPSR1 Q6W5P4 1/20 0.51
BCHE P06276 2/20 0.50
TYR P14679 2/20 0.50
ACHE P22303 2/20 0.50
SLC22A3 O75751 1/20 0.50
PMP22 Q01453 1/20 0.50
GAA P10253 1/20 0.49
MAOB P27338 1/20 0.47
THRA P10827 1/20 0.46
THRB P10828 1/20 0.46
FOS P01100 1/20 0.46
TTR P02766 1/20 0.46
JUN P05412 1/20 0.46
NR3C1 P04150 1/20 0.46
HSD17B1 P14061 1/20 0.46
HSD17B2 P37059 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30375046 1.00 TSHR (0.53) TSHRCYP3A4BLMNFKB1NPSR1
SCHEMBL3863800 0.89 MAPT (0.50) TSHRCYP3A4BLMNFKB1NPSR1
SCHEMBL20563424 0.88 TSHR (0.65) TSHRCYP3A4BLMNFKB1NPSR1
SCHEMBL1596291 0.86 TSHR (0.62) TSHRCYP3A4BLMNFKB1NPSR1
SCHEMBL2202046 0.84 ALDH1A1 (0.54) TSHRCYP3A4BCHETYRACHE
SCHEMBL1758832 0.84 GABRA1 (0.47) TSHRCYP3A4BLMNFKB1TYR
SCHEMBL31516847 0.82 TSHR (0.59) TSHRCYP3A4BLMNFKB1NPSR1
SCHEMBL29625307 0.82 TSHR (0.62) TSHRCYP3A4BLMNFKB1NPSR1
SCHEMBL2411502 0.82 TSHR (0.62) TSHRCYP3A4BLMNFKB1NPSR1
SCHEMBL757257 0.81 MAOB (0.62) TSHRCYP3A4BLMNFKB1NPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2018-01-11 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
EP-1496395-B1 Photosensitive resin precursor composition TORAY INDUSTRIES (JP) 2012-06-20 EP disclosed
EP-1862855-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2011-10-05 EP disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
EP-1475665-B1 Positive-type photosensitive resin composition TORAY INDUSTRIES (JP) 2009-12-30 EP disclosed
EP-1862855-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2007-12-05 EP disclosed
US-20060159839-A1 Photosensitive resin composition, electronic component using the same, and display using same TORAY INDUSTRIES, INC. (JP) 2006-07-20 US disclosed
EP-1662319-A2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-31 EP disclosed
US-20060110680-A1 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-25 US disclosed
EP-1630605-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME TORAY INDUSTRIES, INC. (JP) 2006-03-01 EP disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME EED, RPL19, RARA TSHR 3566/4885CYP3A4 3788/4885BLM 1395/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA TSHR 3566/4885CYP3A4 3788/4885BLM 1395/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.