SCHEMBL757257

SCHEMBL757257

COc1cc(C(c2ccc(O)cc2)c2ccc(O)cc2)ccc1O

nearest known ligand 0.62

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MAOB P27338 2/20 0.62
TSHR P16473 2/20 0.57
CYP3A4 P08684 1/20 0.57
BLM P54132 2/20 0.56
NFKB1 P19838 1/20 0.56
NPSR1 Q6W5P4 1/20 0.56
PMP22 Q01453 1/20 0.54
BCHE P06276 2/20 0.53
TYR P14679 2/20 0.53
ACHE P22303 2/20 0.53
GAA P10253 2/20 0.52
SLC22A3 O75751 1/20 0.50
ABCB1 P08183 1/20 0.48
AKR1B1 P15121 1/20 0.48
MAOA P21397 1/20 0.48
CYP19A1 P11511 1/20 0.48
NQO1 P15559 1/20 0.47
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8768786 1.00 MAOB (0.62) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL3413913 1.00 MAOB (0.62) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL29375595 1.00 MAOB (0.62) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL8146274 1.00 MAOB (0.62) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL1596291 0.94 TSHR (0.62) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL20563424 0.92 TSHR (0.65) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL31516847 0.87 TSHR (0.59) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL30826323 0.84 TSHR (0.56) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL2865089 0.84 TSHR (0.56) MAOBTSHRCYP3A4BLMNFKB1
SCHEMBL1758407 0.84 BCHE (0.44) MAOBTSHRCYP3A4BLMNFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 253 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
US-20240248396-A1 XANTHENE COMPOUND, RESIN COMPOSITION, CURED OBJECT, METHOD FOR PRODUCING CURED OBJECT, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2024-07-25 US disclosed
US-11953830-B2 Photosensitive resin composition, photosensitive resin sheet, cured film, method for producing cured film, organic EL display device and electronic component TORAY INDUSTRIES, INC. (JP) 2024-04-09 US disclosed
CN-117043676-A Positive photosensitive pigment composition, cured film containing cured product thereof, and organic EL display device 东丽株式会社 2023-11-10 CN disclosed
WO-2023153390-A1 PHOTOSENSITIVE RESIN SHEET, CURED FILM, AND MULTILAYER WIRING SUBSTRATE 東レ株式会社 2023-08-17 WO disclosed
CN-116360213-A Resin composition and photoresist patterning method using the same 深圳市容大感光科技股份有限公司 2023-06-30 CN disclosed
WO-2023120352-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED OBJECT, CURED OBJECT MANUFACTURING METHOD, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE 東レ株式会社 2023-06-29 WO disclosed
CN-113785023-B Water-based ink composition for reversible thermochromic writing instrument, refill for refill and water-based ballpoint pen incorporating same 株式会社百乐 2023-05-12 CN disclosed
US-5853948-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-12-29 US disclosed
US-5738968-A Positive photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-04-14 US disclosed
US-5728504-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-03-17 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240248396-A1 XANTHENE COMPOUND, RESIN COMPOSITION, CURED OBJECT, METHOD FOR PRODUCING CURED OBJECT, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE NLRP3, XPA, ASIC1 MAOB 1528/4885TSHR 4656/4885CYP3A4 3979/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.