Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.47 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.47 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.46 |
| ▸ | GAA | P10253 | 2/20 | 0.46 |
| ▸ | MAOB | P27338 | 1/20 | 0.41 |
| ▸ | MAOA | P21397 | 1/20 | 0.41 |
| ▸ | LTA4H | P09960 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | BRD4 | O60885 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
| ▸ | TTR | P02766 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
| ▸ | RAB9A | P51151 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | NLRP3 | Q96P20 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30561268 | 0.79 | CYP1A2 (0.52) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL679994 | 0.79 | CYP1A2 (0.52) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL18153666 | 0.77 | CYP3A4 (0.50) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL10006897 | 0.75 | LTA4H (0.55) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL3331237 | 0.75 | LTA4H (0.44) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL2943595 | 0.74 | CYP1A2 (0.56) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL4456664 | 0.74 | CYP1A2 (0.47) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL9309591 | 0.74 | CYP1A2 (0.44) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL11692589 | 0.73 | TTR (0.53) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 | |
| SCHEMBL2968813 | 0.72 | CYP3A4 (0.62) | CYP1A2CYP3A4CYP2C9CYP2C19ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118139742-A | Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| US-11827789-B2 | Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof | RESONAC CORPORATION (JP) | 2023-11-28 | — | — | US | disclosed |
| WO-2023074646-A1 | RESIN-COATED METAL FOIL, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| US-11553593-B2 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| US-11331888-B2 | Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-17 | — | — | US | disclosed |
| CN-109565931-B | Composite film for electronic device using high-frequency band signal, printed wiring board, and method for manufacturing the same | 昭和电工材料株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-109476924-B | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | 昭和电工材料株式会社 | 2022-02-18 | — | — | CN | disclosed |
| CN-108699408-B | Adhesive film for multilayer printed wiring board | 昭和电工材料株式会社 | 2021-11-05 | — | — | CN | disclosed |
| US-20210235582-A1 | RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD | RESONAC CORPORATION (JP) | 2021-07-29 | — | — | US | disclosed |
| US-11049825-B2 | Method for producing semiconductor device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| US-20180327593-A1 | THERMOSETTING RESIN COMPOSITION, RESIN FILM FOR INTERLAYER INSULATION, COMPOSITE FILM, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SAME | RESONAC CORPORATION (JP) | 2018-11-15 | — | — | US | disclosed |
| US-20140151091-A1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-06-05 | — | — | US | disclosed |
| US-20120305291-A1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-12-06 | — | — | US | disclosed |
| US-20120178332-A1 | Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2012-07-12 | — | — | US | disclosed |
| EP-1876873-B1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | NIPPON KAYAKU KK (JP) | 2011-07-27 | — | — | EP | disclosed |
| US-20090056982-A1 | Process for producing a double-sided flexible printed board and double-sided flexible printed board | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-03-05 | — | — | US | disclosed |
| US-7384683-B2 | Substrate for flexible printed wiring board and method for manufacturing the same | UNITIKA LTD. (JP) | 2008-06-10 | — | — | US | disclosed |
| EP-1876873-A1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | Nippon Kayaku Kabushiki Kaisha (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-20070071984-A1 | Substrate for flexible printed wiring board and method for manufacturing the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-03-29 | — | — | US | disclosed |
| EP-1667501-A1 | SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME | UNITIKA LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |