Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.37 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | POLB | P06746 | 1/20 | 0.37 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.35 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31226430 | 0.86 | ALDH1A1 (0.47) | ALDH1A1CYP3A4TP53TSHRTDP1 | |
| SCHEMBL6943999 | 0.85 | ALDH1A1 (0.58) | ALDH1A1CYP3A4TP53TSHRTDP1 | |
| SCHEMBL27893642 | 0.82 | CYP1A2 (0.43) | ALDH1A1CYP3A4TP53TSHRHSD17B10 | |
| SCHEMBL2209767 | 0.82 | HSD17B10 (0.42) | ALDH1A1CYP3A4TP53TSHRTDP1 | |
| SCHEMBL2215565 | 0.79 | ALDH1A1 (0.41) | ALDH1A1CYP3A4TSHRTDP1MAPT | |
| SCHEMBL23146537 | 0.78 | ALDH1A1 (0.50) | ALDH1A1CYP3A4TP53TSHRTDP1 | |
| SCHEMBL5050464 | 0.78 | ALDH1A1 (0.67) | ALDH1A1CYP3A4TP53TSHRTDP1 | |
| SCHEMBL12855682 | 0.77 | ALDH1A1 (0.46) | ALDH1A1CYP3A4TP53TSHRTDP1 | |
| SCHEMBL22366691 | 0.76 | ALDH1A1 (0.48) | ALDH1A1CYP3A4TP53TSHRTDP1 | |
| SCHEMBL28207980 | 0.76 | ALDH1A1 (0.48) | ALDH1A1CYP3A4TP53TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11827789-B2 | Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof | RESONAC CORPORATION (JP) | 2023-11-28 | — | — | US | disclosed |
| US-11553593-B2 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| US-11331888-B2 | Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-17 | — | — | US | disclosed |
| US-20210235582-A1 | RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD | RESONAC CORPORATION (JP) | 2021-07-29 | — | — | US | disclosed |
| US-11049825-B2 | Method for producing semiconductor device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| US-20200194391-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2020-06-18 | — | — | US | disclosed |
| US-10544305-B2 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-01-28 | — | — | US | disclosed |
| EP-3553816-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2019-10-16 | — | — | EP | disclosed |
| US-20190283373-A1 | COMPOSITE FILM FOR ELECTRONIC DEVICES USING HIGH FREQUENCY BAND SIGNALS, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR | RESONAC CORPORATION (JP) | 2019-09-19 | — | — | US | disclosed |
| US-20190284395-A1 | THERMOSETTING RESIN COMPOSITION, INTERLAYER INSULATION RESIN FILM, COMPOSITE FILM, PRINTED WIRING BOARD, AND PRODUCTION METHOD THEREOF | RESONAC CORPORATION (JP) | 2019-09-19 | — | — | US | disclosed |
| EP-2716793-B1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME | HITACHI CHEMICAL CO LTD (JP) | 2019-04-10 | — | — | EP | disclosed |
| US-20180327593-A1 | THERMOSETTING RESIN COMPOSITION, RESIN FILM FOR INTERLAYER INSULATION, COMPOSITE FILM, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SAME | RESONAC CORPORATION (JP) | 2018-11-15 | — | — | US | disclosed |
| US-20140151091-A1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-06-05 | — | — | US | disclosed |
| US-20120305291-A1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-12-06 | — | — | US | disclosed |
| EP-1876873-B1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | NIPPON KAYAKU KK (JP) | 2011-07-27 | — | — | EP | disclosed |
| US-20090056982-A1 | Process for producing a double-sided flexible printed board and double-sided flexible printed board | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-03-05 | — | — | US | disclosed |
| US-7384683-B2 | Substrate for flexible printed wiring board and method for manufacturing the same | UNITIKA LTD. (JP) | 2008-06-10 | — | — | US | disclosed |
| EP-1876873-A1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | Nippon Kayaku Kabushiki Kaisha (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-20070071984-A1 | Substrate for flexible printed wiring board and method for manufacturing the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-03-29 | — | — | US | disclosed |
| EP-1667501-A1 | SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME | UNITIKA LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |