SCHEMBL2222700

SCHEMBL2222700

CCc1cc(CO)cc(CO)c1O

nearest known ligand 0.63

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.63
CASP6 P55212 1/20 0.63
SHBG P04278 1/20 0.50
MAPT P10636 1/20 0.46
GABRA1 P14867 1/20 0.44
GABRB2 P47870 1/20 0.44
ACHE P22303 1/20 0.42
DHFR P00374 2/20 0.41
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2C9 P11712 1/20 0.39
PKM P14618 1/20 0.38
BACE1 P56817 1/20 0.37
HSPA5 P11021 1/20 0.37
CYP4F2 P78329 1/20 0.35
CYP4A11 Q02928 1/20 0.35
TRPV1 Q8NER1 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11522991 0.95 KDM4E (0.56) KDM4ECASP6SHBGMAPTGABRA1
SCHEMBL216792 0.88 KDM4E (0.70) KDM4ECASP6SHBGMAPTACHE
SCHEMBL2221247 0.86 SHBG (0.54) KDM4ECASP6SHBGMAPTGABRA1
Acetic Acid SCHEMBL9330895 0.84 KDM4E (0.61) KDM4ECASP6SHBGMAPTGABRA1
Dimethylamine SCHEMBL3843461 0.84 KDM4E (0.59) KDM4ECASP6SHBGMAPTACHE
SCHEMBL16001171 0.84 GABRA1 (0.46) KDM4ECASP6SHBGGABRA1GABRB2
SCHEMBL10821832 0.83 SHBG (0.62) KDM4ECASP6SHBGMAPTGABRA1
SCHEMBL31265753 0.83 SHBG (0.62) KDM4ECASP6SHBGMAPTGABRA1
SCHEMBL11519916 0.82 KDM4E (0.44) KDM4ECASP6SHBGMAPTGABRA1
SCHEMBL15080879 0.82 SHBG (0.45) KDM4ECASP6SHBGGABRA1GABRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 170 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12044968-B2 Protective film-forming composition having acetal structure and amide structure NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-12044968-B2 Protective film-forming composition having acetal structure and amide structure NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-12025916-B2 Resist underlayer film-forming composition that contains triaryldiamine-containing novolac resin to which aromatic vinyl compound is added NISSAN CHEMICAL CORPORATION (JP) 2024-07-02 US disclosed
US-12025916-B2 Resist underlayer film-forming composition that contains triaryldiamine-containing novolac resin to which aromatic vinyl compound is added NISSAN CHEMICAL CORPORATION (JP) 2024-07-02 US disclosed
WO-2024128157-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM 日産化学株式会社 2024-06-20 WO disclosed
EP-4310157-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING MACHINED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-01-24 EP disclosed
US-11815815-B2 Composition for forming silicon-containing resist underlayer film removable by wet process NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2023-11-14 US disclosed
US-20230359123-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-11-09 US disclosed
US-20230359123-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-11-09 US disclosed
US-20230350299-A1 STEP SUBSTRATE COATING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-11-02 US disclosed
US-20110173807-A1 DISPERSION FOR DISPOSING FINE PARTICLE AT PREDETERMINED POINT ON SUBSTRATE BY INK-JET PRINTING NATOCO CO., LTD. (JP) 2011-07-21 US disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
US-20100316953-A1 SILOXANE-BASED RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-12-16 US disclosed
US-7476476-B2 Photosensitive resin composition, electronic component using the same, and display unit using the same TORAY INDUSTRIES, INC. (JP) 2009-01-13 US disclosed
US-20080108723-A1 Photosensitive Resin Composition TORAY INDUSTRIES, INC. (JP) 2008-05-08 US disclosed
US-20080108723-A1 Photosensitive Resin Composition TORAY INDUSTRIES, INC. (JP) 2008-05-08 US disclosed
EP-0117759-B1 POLYNUCLEAR POLYHYDRIC PHENOLS AND PROCESS FOR PREPARATION THEREOF MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1987-09-30 EP disclosed
US-4614826-A CURABLE TO EPOXY RESINS; HEAT RESISTANCE MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1986-09-30 US disclosed
EP-0117759-A1 Polynuclear polyhydric phenols and process for preparation thereof MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1984-09-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100316953-A1 SILOXANE-BASED RESIN COMPOSITION ICAM1, ESD, CAD KDM4E 117/4885CASP6 3132/4885SHBG 3852/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.