SCHEMBL2229500

SCHEMBL2229500

O=C(O)C1CCC(C(=O)N(C2CCCCC2)C2CCCCC2)CC1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.38
PLG P00747 1/20 0.38
PLAT P00750 1/20 0.38
PHGDH O43175 1/20 0.38
TSHR P16473 2/20 0.37
GABRP O00591 1/20 0.37
GABRD O14764 1/20 0.37
GABRA1 P14867 1/20 0.37
GABRB1 P18505 1/20 0.37
GABRG2 P18507 1/20 0.37
GABRB3 P28472 1/20 0.37
GABRA5 P31644 1/20 0.37
GABRA3 P34903 1/20 0.37
GABRA2 P47869 1/20 0.37
GABRB2 P47870 1/20 0.37
GABRA4 P48169 1/20 0.37
GABRE P78334 1/20 0.37
PMP22 Q01453 1/20 0.37
GABRA6 Q16445 1/20 0.37
GABRG1 Q8N1C3 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2229504 0.91 PHGDH (0.43) LMNAPHGDHTSHRCES2CES1
SCHEMBL1422071 0.87 CES2 (0.48) LMNAPHGDHTSHRCES2CES1
SCHEMBL556990 0.82 ALDH1A1 (0.38) LMNAPHGDHTSHRCES2CES1
SCHEMBL9001734 0.80 PHGDH (0.41) LMNAPHGDHTSHRCES2CES1
SCHEMBL2606446 0.80 LMNA (0.39) LMNAPLGPLATPHGDHTSHR
SCHEMBL9001731 0.78 CES2 (0.44) LMNAPHGDHTSHRCES2CES1
SCHEMBL8828962 0.77 LMNA (0.50) LMNAPLGPLATPHGDHTSHR
SCHEMBL14821407 0.77 CES2 (0.58) LMNAPLGPLATTSHRGABRP
SCHEMBL12491884 0.77 CES2 (0.58) LMNAPLGPLATTSHRGABRP
SCHEMBL12490833 0.77 CES2 (0.58) LMNAPLGPLATTSHRGABRP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10479889-B2 Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-11-19 US claimed
US-20160185954-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE MADE THEREFROM, AND METHOD OF PREPARING THE COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-06-30 US claimed
EP-1454958-B1 LACTIC ACID POLYMER COMPOSITION AND MOLDED OBJECT THEREOF NEW JAPAN CHEM CO LTD (JP) 2006-10-04 EP claimed
US-20050001349-A1 Lactic acid polymer composition and molded object thereof NEW JAPAN CHEMICAL CO., LTD. (JP) 2005-01-06 US claimed
EP-1454958-A1 LACTIC ACID POLYMER COMPOSITION AND MOLDED OBJECT THEREOF NEW JAPAN CHEMICAL CO.,LTD. (JP) 2004-09-08 EP claimed
US-5973076-A MOLDING; CONTROLLING TEMPERATURE IN PRESENCE OF AN AMIDE COMPOUND NEW JAPAN CHEMICAL CO., LTD. (JP) 1999-10-26 US claimed
EP-0776933-B1 Polybutene-1 resin composition and a method of accelerating the crystal transformation NEW JAPAN CHEM CO LTD (JP) 1999-08-04 EP claimed
EP-0776933-A1 Polybutene-1 resin composition and a method of accelerating the crystal transformation NEW JAPAN CHEMICAL CO.,LTD. (JP) 1997-06-04 EP claimed
US-20220403111-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITON FOR AUTOMOTIVE COOLING PARTS, AND AUTOMOTIVE COOLING PARTS TORAY INDUSTRIES, INC. (JP) 2022-12-22 US disclosed
US-20220380598-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION FOR AUTOMOTIVE COOLING PARTS, AND AUTOMOTIVE COOLING PARTS TORAY INDUSTRIES, INC. (JP) 2022-12-01 US disclosed
EP-4063095-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION FOR AUTOMOTIVE COOLING PARTS, AND AUTOMOTIVE COOLING PARTS Toray Industries, Inc. (JP) 2022-09-28 EP disclosed
EP-4063096-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION FOR AUTOMOBILE COOLING COMPONENT, AND AUTOMOBILE COOLING COMPONENT Toray Industries, Inc. (JP) 2022-09-28 EP disclosed
CN-114729189-A Polyphenylene sulfide resin composition for automobile cooling part and automobile cooling part 东丽株式会社 2022-07-08 CN disclosed
CN-114729188-A Polyphenylene sulfide resin composition for automobile cooling part and automobile cooling part 东丽株式会社 2022-07-08 CN disclosed
US-20100130651-A1 CRYSTALLINE POLYLACTIC ACID RESIN COMPOSITION AND PRODUCT MOLDED/FORMED THEREFROM UNITIKA LTD. (JP) 2010-05-27 US disclosed
EP-1454958-B1 LACTIC ACID POLYMER COMPOSITION AND MOLDED OBJECT THEREOF NEW JAPAN CHEM CO LTD (JP) 2006-10-04 EP disclosed
EP-1454958-A1 LACTIC ACID POLYMER COMPOSITION AND MOLDED OBJECT THEREOF NEW JAPAN CHEMICAL CO.,LTD. (JP) 2004-09-08 EP disclosed
US-5973076-A MOLDING; CONTROLLING TEMPERATURE IN PRESENCE OF AN AMIDE COMPOUND NEW JAPAN CHEMICAL CO., LTD. (JP) 1999-10-26 US disclosed
EP-0776933-B1 Polybutene-1 resin composition and a method of accelerating the crystal transformation NEW JAPAN CHEM CO LTD (JP) 1999-08-04 EP disclosed
EP-0776933-A1 Polybutene-1 resin composition and a method of accelerating the crystal transformation NEW JAPAN CHEMICAL CO.,LTD. (JP) 1997-06-04 EP disclosed