SCHEMBL2230816

SCHEMBL2230816

C=C(C)C(=O)OCCOc1ccc(C2(c3ccc(OCCOC(=O)C(=C)C)c(-c4ccccc4)c3)c3ccccc3-c3ccccc32)cc1-c1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 6/20 0.40
ALDH1A1 P00352 5/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
SLC6A9 P48067 2/20 0.39
PTGDR2 Q9Y5Y4 3/20 0.39
SYK P43405 1/20 0.38
AURKB Q96GD4 1/20 0.38
INCENP Q9NQS7 1/20 0.38
USP2 O75604 1/20 0.37
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
HTR7 P34969 1/20 0.36
ESR1 P03372 1/20 0.36
ESR2 Q92731 1/20 0.36
ADRB2 P07550 1/20 0.36
ADRB1 P08588 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29499719 1.00 KDM4E (0.40) KDM4EALDH1A1SMN1; SMN2SLC6A9PTGDR2
SCHEMBL29499715 1.00 KDM4E (0.40) KDM4EALDH1A1SMN1; SMN2SLC6A9PTGDR2
SCHEMBL2231419 0.95 KDM4E (0.40) KDM4EALDH1A1SMN1; SMN2SLC6A9PTGDR2
SCHEMBL819025 0.89 ESR1 (0.39) KDM4EALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL2231834 0.87 ESR1 (0.46) KDM4EALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL19009924 0.86 THRB (0.38) KDM4EALDH1A1SMN1; SMN2USP2MEN1
SCHEMBL4948908 0.86 ESR1 (0.37) KDM4EALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL26263070 0.85 KDM4E (0.43) KDM4EALDH1A1SMN1; SMN2SLC6A9PTGDR2
SCHEMBL2296138 0.85 KDM4E (0.37) KDM4EALDH1A1SMN1; SMN2SLC6A9PTGDR2
SCHEMBL21829175 0.84 POLB (0.41) SMN1; SMN2ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11561470-B2 Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same TORAY INDUSTRIES, INC. (JP) 2023-01-24 US disclosed
EP-3508924-B1 PHOTOSENSITIVE COMPOSITION FOR HOLOGRAM RECORDING, HOLOGRAM RECORDING MEDIUM, AND HOLOGRAM SONY GROUP CORP (JP) 2022-05-04 EP disclosed
US-20200110337-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, ORGANIC EL DISPLAY PROVIDED WITH CURED FILM, AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES, INC. (JP) 2020-04-09 US disclosed
EP-3508924-A1 PHOTOSENSITIVE COMPOSITION FOR HOLOGRAM RECORDING, HOLOGRAM RECORDING MEDIUM, AND HOLOGRAM Sony Corporation (JP) 2019-07-10 EP disclosed
US-20190202946-A1 PHOTOSENSITIVE COMPOSITION FOR HOLOGRAM RECORDING, HOLOGRAM RECORDING MEDIUM, AND HOLOGRAM SONY CORPORATION (JP) 2019-07-04 US disclosed
EP-2360194-B1 SILOXANE RESIN COMPOSITION AND PROTECTIVE FILM FOR TOUCH PANEL USING SAME TORAY INDUSTRIES (JP) 2015-03-11 EP disclosed
US-8492450-B2 Siloxane resin composition and protective film for touch panel using the same TORAY INDUSTRIES, INC. (JP) 2013-07-23 US disclosed
US-20110230584-A1 SILOXANE RESIN COMPOSITION AND PROTECTIVE FILM FOR TOUCH PANEL USING THE SAME TORAY INDUSTRIES, INC. (JP) 2011-09-22 US disclosed
EP-2360194-A1 SILOXANE RESIN COMPOSITION AND PROTECTIVE FILM FOR TOUCH PANEL USING SAME Toray Industries, Inc. (JP) 2011-08-24 EP disclosed