Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PSMB5 | P28074 | 1/20 | 0.32 |
| ▸ | JAK2 | O60674 | 1/20 | 0.31 |
| ▸ | JAK3 | P52333 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1585575 | 0.89 | JAK2 (0.31) | JAK2JAK3 | |
| SCHEMBL3166128 | 0.87 | JAK2 (0.33) | PSMB5JAK2JAK3 | |
| SCHEMBL3661359 | 0.85 | — | — | |
| SCHEMBL1584751 | 0.84 | NPC1 (0.33) | PSMB5 | |
| SCHEMBL2270492 | 0.80 | ALDH1A1 (0.34) | PSMB5 | |
| SCHEMBL1258428 | 0.78 | NPC1 (0.33) | PSMB5 | |
| SCHEMBL2101945 | 0.77 | ALDH1A1 (0.33) | PSMB5 | |
| SCHEMBL6432630 | 0.77 | ALDH1A1 (0.33) | PSMB5 | |
| SCHEMBL296847 | 0.75 | JAK2 (0.34) | PSMB5JAK2JAK3 | |
| SCHEMBL4325254 | 0.73 | JAK2 (0.34) | PSMB5JAK2JAK3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20130260575-A1 | SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2013-10-03 | — | — | US | claimed |
| WO-2011106218-A2 | ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION | APPLIED MATERIALS, INC. (US) | 2011-09-01 | — | — | WO | claimed |
| US-20110206857-A1 | ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION | APPLIED MATERIALS, INC. (US) | 2011-08-25 | — | — | US | claimed |
| US-8968458-B2 | Composition for resist underlayer film and process for producing same | JSR CORPORATION (JP) | 2015-03-03 | — | — | US | disclosed |
| US-8808446-B2 | Composition for resist underlayer film and process for producing same | JSR CORPORATION (JP) | 2014-08-19 | — | — | US | disclosed |
| US-20130260575-A1 | SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2013-10-03 | — | — | US | disclosed |
| WO-2011106218-A2 | ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION | APPLIED MATERIALS, INC. (US) | 2011-09-01 | — | — | WO | disclosed |
| US-20110206857-A1 | ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION | APPLIED MATERIALS, INC. (US) | 2011-08-25 | — | — | US | disclosed |
| US-20100151384-A1 | COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME | JSR CORPORATION (JP) | 2010-06-17 | — | — | US | disclosed |
| US-20090050020-A1 | COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME | JSR CORPORATION (JP) | 2009-02-26 | — | — | US | disclosed |
| EP-1855159-A1 | COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME | JSR Corporation (JP) | 2007-11-14 | — | — | EP | disclosed |