⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5035540 | 0.81 | LSS (0.33) | — | |
| SCHEMBL20590334 | 0.71 | DNM1 (0.41) | — | |
| SCHEMBL1036555 | 0.71 | — | — | |
| SCHEMBL8834683 | 0.71 | ALDH1A1 (0.30) | — | |
| SCHEMBL2611010 | 0.69 | LMNA (0.32) | — | |
| SCHEMBL14336358 | 0.69 | — | — | |
| SCHEMBL14372109 | 0.65 | — | — | |
| SCHEMBL2443389 | 0.65 | — | — | |
| SCHEMBL17004708 | 0.65 | — | — | |
| SCHEMBL19143107 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230203694-A1 | ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN REFINER | BASF SE (DE) | 2023-06-29 | — | — | US | disclosed |
| US-20230203694-A1 | ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN REFINER | BASF SE (DE) | 2023-06-29 | — | — | US | disclosed |
| US-20230203695-A1 | Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent | BASF SE (DE) | 2023-06-29 | — | — | US | disclosed |
| US-20230203695-A1 | Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent | BASF SE (DE) | 2023-06-29 | — | — | US | disclosed |
| US-11585004-B2 | Composition for cobalt or cobalt alloy electroplating | BASF SE (DE) | 2023-02-21 | — | — | US | disclosed |
| US-11377748-B2 | Composition for cobalt electroplating comprising leveling agent | BASF SE (DE) | 2022-07-05 | — | — | US | disclosed |
| US-20210147994-A1 | COMPOSITION FOR COBALT OR COBALT ALLOY ELECTROPLATING | BASF SE (DE) | 2021-05-20 | — | — | US | disclosed |
| US-20210040635-A1 | COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING | BASF SE (DE) | 2021-02-11 | — | — | US | disclosed |
| US-20200347503-A1 | COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT | BASF SE (DE) | 2020-11-05 | — | — | US | disclosed |
| US-20190226107-A1 | COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING | BASF SE (DE) | 2019-07-25 | — | — | US | disclosed |
| US-8003662-B2 | Heterobicyclic thiophene compounds and methods of use | ARRAY BIOPHARMA, INC. (US) | 2011-08-23 | — | — | US | disclosed |
| EP-1989211-A2 | HETEROBICYCLIC THIOPHENE COMPOUNDS FOR THE TREATMENT OF CANCER | Array Biopharma, Inc. (US) | 2008-11-12 | — | — | EP | disclosed |
| WO-2008063202-A2 | HETEROBICYCLIC THIOPHENE COMPOUNDS FOR THE TREATMENT OF CANCER | ARRAY BIOPHARMA INC. (US) | 2008-05-29 | — | — | WO | disclosed |
| US-20070197537-A1 | Heterobicyclic thiophene compounds and methods of use | ARRAY BIOPHARMA, INC. | 2007-08-23 | — | — | US | disclosed |
| US-5789448-A | TYROSINE KINASE INHIBITORS; ANTICARCINOGENIC AGENTS; SIDE EFFECT REDUCTION | MITSUBISHI CHEMICAL CORPORATION (JP) | 1998-08-04 | — | — | US | disclosed |
| EP-0721930-A1 | BENZOYLETHYLENE DERIVATIVE | MITSUBISHI CHEMICAL CORPORATION (JP) | 1996-07-17 | — | — | EP | disclosed |