Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE | P22303 | 7/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | CA1 | P00915 | 1/20 | 0.35 |
| ▸ | CA2 | P00918 | 1/20 | 0.35 |
| ▸ | CA7 | P43166 | 1/20 | 0.35 |
| ▸ | CA9 | Q16790 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 3/20 | 0.32 |
| ▸ | LMNA | P02545 | 3/20 | 0.32 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.32 |
| ▸ | IDO1 | P14902 | 1/20 | 0.31 |
| ▸ | CES2 | O00748 | 1/20 | 0.31 |
| ▸ | CES1 | P23141 | 1/20 | 0.31 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1157808 | 1.00 | ACHE (0.44) | ACHETDP1ALDH1A1CA1CA2 | |
| SCHEMBL3132622 | 0.91 | ACHE (0.43) | ACHETDP1ALDH1A1MAPTTSHR | |
| SCHEMBL3144680 | 0.91 | ACHE (0.43) | ACHETDP1ALDH1A1MAPTTSHR | |
| SCHEMBL700714 | 0.89 | CES2 (0.42) | ACHETDP1LMNACES2CES1 | |
| SCHEMBL12762110 | 0.88 | ACHE (0.57) | ACHETDP1ALDH1A1CA1CA2 | |
| SCHEMBL37146 | 0.88 | ACHE (0.57) | ACHETDP1ALDH1A1CA1CA2 | |
| Hydrogen Sulfide SCHEMBL29644447 | 0.85 | ACHE (0.53) | ACHETDP1ALDH1A1CA1CA2 | |
| Hydrochloric Acid SCHEMBL482494 | 0.85 | ACHE (0.53) | ACHETDP1ALDH1A1CA1CA2 | |
| Bromide SCHEMBL4916423 | 0.85 | ACHE (0.53) | ACHETDP1ALDH1A1CA1CA2 | |
| Water SCHEMBL1765019 | 0.85 | ACHE (0.53) | ACHETDP1ALDH1A1CA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2477215-A2 | Resin composition, embedding material, insulating layer and semiconductor device | Sumitomo Bakelite Company Limited (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-7999354-B2 | Resin composition, filling material, insulating layer and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-20100193122-A1 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100181684-A1 | RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-07-22 | — | — | US | disclosed |
| EP-2166036-A1 | RESIN COMPOSITION, EMBEDDING MATERIAL, INSULATING LAYER, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2010-03-24 | — | — | EP | disclosed |
| EP-2161744-A1 | ELECTRONIC DEVICE MANUFACTURING METHOD | Sumitomo Bakelite Co., Ltd. (JP) | 2010-03-10 | — | — | EP | disclosed |
| US-20060228562-A1 | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2006-10-12 | — | — | US | disclosed |