SCHEMBL2284808

SCHEMBL2284808

CC(OC1([SiH3])CCCCO1)c1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.32
GLA P06280 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
ADRA2A P08913 1/20 0.31
ADRA2B P18089 1/20 0.31
ADRA2C P18825 1/20 0.31
LMNA P02545 2/20 0.31
HPGD P15428 1/20 0.31
OPRM1 P35372 2/20 0.31
SLC6A3 Q01959 2/20 0.30
HTT P42858 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19874977 0.75
SCHEMBL2283511 0.74 LMNA (0.33) ALDH1A1ADRA2AADRA2CLMNAHPGD
SCHEMBL28127207 0.74 HTR1A (0.34)
SCHEMBL4588640 0.73
SCHEMBL28051698 0.72 HTR1A (0.33)
SCHEMBL28680577 0.72 LMNA (0.32) ALDH1A1ADRA2AADRA2CLMNAHPGD
SCHEMBL17024087 0.71 OPRM1 (0.33) ALDH1A1GLASMN1; SMN2ADRA2AADRA2C
SCHEMBL4533819 0.70 TAAR1 (0.37) HPGDOPRM1
SCHEMBL28009306 0.69 MEN1 (0.33) ALDH1A1OPRM1
SCHEMBL3219070 0.69 MEN1 (0.33) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-3993839-A ORGANO-SILOXY TITANIC ACID ESTERS SHINETSU CHEMICAL COMPANY (JA) 1976-11-23 US claimed
EP-4703435-A1 THERMALLY CONDUCTIVE MEMBER, THERMALLY CONDUCTIVE COMPOSITION, STRUCTURE, AND METHOD FOR REWORKING STRUCTURE Sekisui Chemical Co., Ltd. (JP) 2026-03-04 EP disclosed
WO-2025105476-A1 THERMALLY CONDUCTIVE SHEET SUPPLY BODY AND METHOD FOR MANUFACTURING SAME 積水化学工業株式会社 2025-05-22 WO disclosed
WO-2025089425-A1 THERMALLY CONDUCTIVE SHEET 積水化学工業株式会社 2025-05-01 WO disclosed
WO-2024225391-A1 THERMALLY CONDUCTIVE SHEET 積水化学工業株式会社 2024-10-31 WO disclosed
WO-2024225395-A1 THERMALLY CONDUCTIVE MEMBER, THERMALLY CONDUCTIVE COMPOSITION, STRUCTURE, AND METHOD FOR REWORKING STRUCTURE 積水化学工業株式会社 2024-10-31 WO disclosed
WO-2024204755-A1 THERMALLY CONDUCTIVE SHEET AND METHOD FOR PRODUCING SAME 積水化学工業株式会社 2024-10-03 WO disclosed
WO-2024204754-A1 THERMALLY CONDUCTIVE SHEET AND MANUFACTURING METHOD THEREFOR 積水化学工業株式会社 2024-10-03 WO disclosed
WO-2024204753-A1 THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING SAME 積水化学工業株式会社 2024-10-03 WO disclosed
CN-118715612-A Thermally conductive sheet, method of assembling the same, and method of manufacturing the same 积水保力马科技株式会社 2024-09-27 CN disclosed
CN-113906106-B Thermally conductive composition package and 2-liquid curable thermally conductive composition 积水保力马科技株式会社 2023-08-22 CN disclosed
US-20110196068-A1 RESIN COMPOSITION FOR OPTICAL LENS AND OPTICAL PACKAGING NAN YA PLASTICS CORPORATION (TW) 2011-08-11 US disclosed
WO-1997003812-A1 MOLDABLE ARTICLES OF PTFE/ELASTOMER COMPOSITES AND PROCESSES FOR MOLDING W.L. GORE & ASSOCIATES, INC. (US) 1997-02-06 WO disclosed
US-3993839-A ORGANO-SILOXY TITANIC ACID ESTERS SHINETSU CHEMICAL COMPANY (JA) 1976-11-23 US disclosed