SCHEMBL2289273

SCHEMBL2289273

CCC1(C(OC(=O)c2ccc(C(=O)OC(C3(CC)COC3)C3(CC)COC3)cc2)C2(CC)COC2)COC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 2/20 0.39
CA1 P00915 2/20 0.39
CA2 P00918 2/20 0.39
CA7 P43166 2/20 0.39
CA9 Q16790 2/20 0.39
CA14 Q9ULX7 2/20 0.39
L3MBTL1 Q9Y468 3/20 0.38
ALDH1A1 P00352 2/20 0.37
KDM4E B2RXH2 1/20 0.37
ALOX12 P18054 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
CYP4F2 P78329 1/20 0.37
CYP4A11 Q02928 1/20 0.37
NPC1 O15118 2/20 0.36
TSHR P16473 1/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
PDCD1 Q15116 1/20 0.36
CD274 Q9NZQ7 1/20 0.36
ESR1 P03372 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL132923 0.94 MAPT (0.42) CA12CA1CA2CA7CA9
SCHEMBL28477024 0.82 L3MBTL1 (0.35) CA12CA1CA2CA7CA9
SCHEMBL28477026 0.78 MAPT (0.39) CA12CA1CA2CA7CA9
SCHEMBL21459247 0.78
SCHEMBL10396626 0.72 CTSK (0.38) CA12CA1CA2CA7CA9
SCHEMBL686318 0.69 TSHR (0.50) CA12CA1CA2CA7CA9
SCHEMBL21051112 0.69 ALDH1A1 (0.36) ALDH1A1MEN1KMT2ALMNASMN1; SMN2
SCHEMBL504534 0.68
SCHEMBL28477025 0.67 MAPT (0.40) L3MBTL1ALDH1A1KDM4EALOX12NPSR1
SCHEMBL278715 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118284639-A Latent curing agent, process for producing the same, and curable composition 迪睿合株式会社 2024-07-02 CN disclosed
US-20240026149-A1 CURING AGENT, METHOD OF PRODUCING CURING AGENT, AND CURABLE COMPOSITION DEXERIALS CORPORATION (JP) 2024-01-25 US disclosed
CN-116783231-A Cationic curing agent, process for producing the same, and cationically curable composition 迪睿合株式会社 2023-09-19 CN disclosed
CN-113396174-A Latent curing agent, method for producing same, composition for forming coating film, and cationically curable composition 迪睿合株式会社 2021-09-14 CN disclosed
CN-109312058-B Latent curing agent, process for producing the same, and heat-curable epoxy resin composition 迪睿合株式会社 2021-05-14 CN disclosed
CN-112292414-A Cation-curable composition and method for producing cured product 迪睿合株式会社 2021-01-29 CN disclosed
EP-2586817-B1 ALUMINUM CHELATE-BASED LATENT CURING AGENT DEXERIALS CORP (JP) 2020-03-25 EP disclosed
CN-110809593-A Cation-curable composition 迪睿合株式会社 2020-02-18 CN disclosed
US-8835572-B2 Aluminum chelate latent curing agent DEXERIALS CORPORATION (JP) 2014-09-16 US disclosed
EP-2586817-A1 ALUMINUM CHELATE-BASED LATENT CURING AGENT Sony Chemical & Information Device Corporation (JP) 2013-05-01 EP disclosed
US-8198342-B2 Aluminum chelate latent curing agent and production method thereof SONY CHEMICAL AND INFORMATION DEVICE CORPORATION (JP) 2012-06-12 US disclosed
US-20120119156-A1 ALUMINUM CHELATE LATENT CURING AGENT SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2012-05-17 US disclosed
US-20110196110-A1 ALUMINUM CHELATE LATENT CURING AGENT AND PRODUCTION METHOD THEREOF SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2011-08-11 US disclosed
US-20100331435-A1 ALUMINUM CHELATE LATENT CURING AGENT AND PRODUCTION METHOD THEREOF SONY CHEMICAL & INFORMATION DEVICE CORP. (JP) 2010-12-30 US disclosed