SCHEMBL22939619

SCHEMBL22939619

CN(C)c1c(N)ccc(C(=O)c2ccccc2O)c1O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SPR P35270 1/20 0.47
HPGD P15428 4/20 0.44
LMNA P02545 2/20 0.44
CYP3A4 P08684 2/20 0.44
HIF1A Q16665 2/20 0.44
CYP1A2 P05177 1/20 0.44
PGR P06401 1/20 0.44
ADORA3 P0DMS8 1/20 0.44
AR P10275 1/20 0.44
CHRM1 P11229 1/20 0.44
ALOX15 P16050 1/20 0.44
TBXA2R P21731 1/20 0.44
SLC6A2 P23975 1/20 0.44
CYP2C19 P33261 1/20 0.44
ADRA1A P35348 1/20 0.44
TSHR P16473 4/20 0.42
ALDH1A1 P00352 4/20 0.42
SMN1; SMN2 Q16637 4/20 0.42
MAPT P10636 3/20 0.42
GAA P10253 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22939531 0.86 HPGD (0.47) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22939388 0.84 SMN1; SMN2 (0.48) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22939036 0.83 ALDH1A1 (0.52) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22938982 0.83 SMN1; SMN2 (0.51) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22939641 0.80 SPR (0.50) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22939620 0.79 SPR (0.49) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22938980 0.79 MAPT (0.50) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22939131 0.77 SMN1; SMN2 (0.47) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL22938954 0.76 SMN1; SMN2 (0.55) SPRHPGDLMNACYP3A4HIF1A
SCHEMBL11160358 0.75 MMP2 (0.60) SPRHPGDLMNACYP3A4HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11407063-B2 Protective film forming agent and method for producing semiconductor chip TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-09 US disclosed
US-20210031300-A1 PROTECTIVE FILM FORMING AGENT AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP TOKYO OHKA KOGYO CO., LTD. (JP) 2021-02-04 US disclosed