SCHEMBL22939620

SCHEMBL22939620

Nc1ccc(C(=O)c2ccccc2O)c(O)c1N

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SPR P35270 1/20 0.49
GSTA1 P08263 2/20 0.49
HPGD P15428 4/20 0.47
KDM4E B2RXH2 4/20 0.47
ALDH1A1 P00352 3/20 0.47
TSHR P16473 3/20 0.47
MAPT P10636 2/20 0.47
HSD17B10 Q99714 1/20 0.47
HIF1A Q16665 2/20 0.46
LMNA P02545 2/20 0.46
ALOX15 P16050 2/20 0.46
CYP1A2 P05177 1/20 0.46
PGR P06401 1/20 0.46
CYP3A4 P08684 1/20 0.46
ADORA3 P0DMS8 1/20 0.46
AR P10275 1/20 0.46
CHRM1 P11229 1/20 0.46
TBXA2R P21731 1/20 0.46
SLC6A2 P23975 1/20 0.46
CYP2C19 P33261 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22939530 0.87 GSTA1 (0.51) SPRGSTA1HPGDKDM4EALDH1A1
SCHEMBL22939641 0.87 SPR (0.50) SPRGSTA1HPGDKDM4EALDH1A1
SCHEMBL22939034 0.84 CASP7 (0.59) SPRGSTA1HPGDKDM4EALDH1A1
SCHEMBL11160358 0.81 MMP2 (0.60) SPRGSTA1HPGDKDM4EALDH1A1
SCHEMBL22939639 0.81 ALDH1A1 (0.48) SPRGSTA1HPGDKDM4EALDH1A1
SCHEMBL301928 0.81 LIG1 (0.55) SPRGSTA1HPGDKDM4EALDH1A1
SCHEMBL30740067 0.81 LIG1 (0.55) SPRGSTA1HPGDKDM4EALDH1A1
SCHEMBL6466249 0.80 MAPT (0.58) KDM4EALDH1A1TSHRMAPTHSD17B10
SCHEMBL28234333 0.80 MMP2 (0.48) HPGDKDM4EALDH1A1TSHRMAPT
SCHEMBL22939619 0.79 SPR (0.47) SPRGSTA1HPGDKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11407063-B2 Protective film forming agent and method for producing semiconductor chip TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-09 US disclosed
US-20210031300-A1 PROTECTIVE FILM FORMING AGENT AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP TOKYO OHKA KOGYO CO., LTD. (JP) 2021-02-04 US disclosed