SCHEMBL22939627

SCHEMBL22939627

O=C(c1ccccc1O)c1ccc(O)c(C(=O)O)c1O

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 4/20 0.53
ALDH1A1 P00352 4/20 0.53
KDM4E B2RXH2 3/20 0.53
CA12 O43570 2/20 0.53
CA1 P00915 2/20 0.53
CA2 P00918 2/20 0.53
CA7 P43166 2/20 0.53
CA9 Q16790 2/20 0.53
CA14 Q9ULX7 2/20 0.53
SMN1; SMN2 Q16637 2/20 0.53
HMGB1 P09429 1/20 0.53
CA4 P22748 1/20 0.53
CA6 P23280 1/20 0.53
NAPRT Q6XQN6 1/20 0.53
GSTA1 P08263 2/20 0.53
CYP3A4 P08684 2/20 0.49
KMT2A Q03164 2/20 0.49
CYP2C9 P11712 1/20 0.49
CYP2C19 P33261 2/20 0.46
LMNA P02545 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22939098 0.91 KMT2A (0.59) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL22938971 0.89 ALDH1A1 (0.59) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL22939141 0.87 HPGD (0.55) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL22939145 0.86 HPGD (0.53) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL22939639 0.85 ALDH1A1 (0.48) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL27617414 0.84 AKR1C3 (0.57) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL22938973 0.83 ALDH1A1 (0.65) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL22938957 0.81 ALDH1A1 (0.49) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL29660832 0.81 GSTA1 (0.56) HPGDALDH1A1KDM4ECA12CA1
SCHEMBL93431 0.81 GSTA1 (0.56) HPGDALDH1A1KDM4ECA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11407063-B2 Protective film forming agent and method for producing semiconductor chip TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-09 US disclosed
US-20210031300-A1 PROTECTIVE FILM FORMING AGENT AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP TOKYO OHKA KOGYO CO., LTD. (JP) 2021-02-04 US disclosed