⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17693335 | 0.86 | MEN1 (0.39) | — | |
| SCHEMBL21312230 | 0.85 | MEN1 (0.35) | — | |
| SCHEMBL7043281 | 0.83 | MEN1 (0.38) | — | |
| SCHEMBL29941785 | 0.83 | POLB (0.50) | — | |
| SCHEMBL14870743 | 0.83 | POLB (0.50) | — | |
| SCHEMBL24278597 | 0.81 | MAOA (0.44) | — | |
| SCHEMBL28459975 | 0.79 | MAOA (0.36) | — | |
| SCHEMBL24119354 | 0.79 | ADRA2A (0.31) | — | |
| SCHEMBL16835547 | 0.78 | MAOA (0.61) | — | |
| SCHEMBL11201145 | 0.78 | TSHR (0.47) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10123412-B2 | Thermosetting polymer formulations, circuit materials, and methods of use thereof | ROGERS CORPORATION (US) | 2018-11-06 | — | — | US | disclosed |
| US-20170218171-A1 | THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF | JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT | 2017-08-03 | — | — | US | disclosed |
| WO-2017132310-A1 | THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF | ROGERS CORPORATION (US) | 2017-08-03 | — | — | WO | disclosed |
| EP-2392603-B1 | EPOXY RESIN COMPOSITION, CURING AGENT, AND CURING ACCELERATOR | NIPPON SODA CO (JP) | 2017-07-26 | — | — | EP | disclosed |
| EP-2489689-B1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NIPPON SODA CO (JP) | 2017-05-10 | — | — | EP | disclosed |
| US-9068074-B2 | Composition for formation of cured epoxy resin, and cured products thereof | NIPPON SODA CO., LTD. (JP) | 2015-06-30 | — | — | US | disclosed |
| US-9023956-B2 | Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor | NIPPON SODA CO., LTD. (JP) | 2015-05-05 | — | — | US | disclosed |
| US-8653160-B2 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation | NIPPON SODA CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-8623942-B2 | Epoxy resin composition, curing agent, and curing accelerator | NIPPON SODA CO., LTD. (JP) | 2014-01-07 | — | — | US | disclosed |
| EP-2617750-A1 | LIQUID CURABLE EPOXY RESIN COMPOSITION AND ADHESIVE AGENT CONTAINING SAME | Nippon Soda Co., Ltd. (JP) | 2013-07-24 | — | — | EP | disclosed |
| US-20130158231-A1 | LIQUID CURABLE EPOXY RESIN COMPOSITION AND ADHESIVE AGENT CONTAINING SAME | NIPPON SODA CO., LTD. (JP) | 2013-06-20 | — | — | US | disclosed |
| EP-2573148-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | Nippon Soda Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130059942-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | NIPPON SODA CO., LTD. (JP) | 2013-03-07 | — | — | US | disclosed |
| EP-2489689-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | Nippon Soda Co., Ltd. (JP) | 2012-08-22 | — | — | EP | disclosed |
| US-20120196991-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) | 2012-08-02 | — | — | US | disclosed |
| EP-2410001-A1 | INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR | Nippon Soda Co., Ltd. (JP) | 2012-01-25 | — | — | EP | disclosed |
| US-20120004349-A1 | Epoxy resin composition, curing agent, and curing accelerator | NIPPON SODA CO., LTD. | 2012-01-05 | — | — | US | disclosed |
| US-20120004377-A1 | CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR | NIPPON SODA CO., LTD. | 2012-01-05 | — | — | US | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |