Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 1/20 | 0.44 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.42 |
| ▸ | MEN1 | O00255 | 4/20 | 0.42 |
| ▸ | LMNA | P02545 | 3/20 | 0.42 |
| ▸ | MAPT | P10636 | 3/20 | 0.42 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | SLC6A2 | P23975 | 3/20 | 0.36 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.36 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | TRPA1 | O75762 | 2/20 | 0.36 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.36 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.36 |
| ▸ | HTR2B | P41595 | 1/20 | 0.36 |
| ▸ | SELL | P14151 | 1/20 | 0.35 |
| ▸ | SELP | P16109 | 1/20 | 0.35 |
| ▸ | SELE | P16581 | 1/20 | 0.35 |
| ▸ | ACHE | P22303 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30149174 | 1.00 | GABRA1 (0.44) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL4027621 | 0.81 | GABRA1 (0.47) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL2467899 | 0.79 | GABRA1 (0.44) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL3656518 | 0.79 | GABRA1 (0.44) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL2863828 | 0.79 | GABRA1 (0.44) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL30375425 | 0.79 | GABRA1 (0.44) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL5385164 | 0.77 | GABRA1 (0.42) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL30374777 | 0.77 | GABRA1 (0.42) | GABRA1GABRB2KMT2AMEN1LMNA | |
| SCHEMBL2200512 | 0.77 | CYP1A2 (0.47) | LMNAMAPTTSHRTP53ACHE | |
| SCHEMBL30375550 | 0.77 | CYP1A2 (0.47) | LMNAMAPTTSHRTP53ACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-1623274-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-02-08 | — | — | EP | claimed |
| WO-2004088423-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| US-20040197704-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-6790582-B1 | NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT | CLARIANT FINANCE BVI LIMITED (VG) | 2004-09-14 | — | — | US | claimed |
| JP-10017508-A | — | — | None | — | — | JP | disclosed |
| US-20220291584-A1 | Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic Component | HD MICROSYSTEMS, LTD. (JP) | 2022-09-15 | — | — | US | disclosed |
| EP-2203783-B1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2019-11-13 | — | — | EP | disclosed |
| EP-2133743-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2018-01-24 | — | — | EP | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-8715918-B2 | Thick film resists | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2014-05-06 | — | — | US | disclosed |
| US-6475693-B1 | Positively photosensitive resin composition | CLARIANT FINANCE (BVI) LIMITED (VG) | 2002-11-05 | — | — | US | disclosed |
| US-6391513-B1 | ALKALI SOLUBLE NOVOLAK RESIN ESTERIFIED WITH 1,2-NAPHTHOQUINONEDIAZIDE-(4-OR 5-)SULFONIC ACID; LIQUID CRYSTAL DISPLAYS, SEMICONDUCTORS, INTEGRATED CIRCUITS | CLARIANT FINANCE (BVI) LIMITED (VG) | 2002-05-21 | — | — | US | disclosed |
| EP-1146394-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION | CLARIANT INTERNATIONAL LTD. (CH) | 2001-10-17 | — | — | EP | disclosed |
| EP-1143298-A1 | PHOTOSENSITIVE COMPOSITION | CLARIANT INTERNATIONAL LTD. (CH) | 2001-10-10 | — | — | EP | disclosed |
| EP-1067435-A1 | POSITIVELY PHOTOSENSITIVE RESIN COMPOSITION | Clariant International Ltd. (CH) | 2001-01-10 | — | — | EP | disclosed |
| EP-1055969-A1 | POSITIVELY PHOTOSENSITIVE RESIN COMPOSITION | Clariant International Ltd. (CH) | 2000-11-29 | — | — | EP | disclosed |
| JP-H1017508-A | NEW POLYPHENOL COMPOUND | HONSHU CHEM IND CO LTD | 1998-01-20 | — | — | JP | disclosed |