SCHEMBL2863828

SCHEMBL2863828

Cc1cc(O)c(C)c(C)c1C(c1ccccc1O)c1c(C)cc(O)c(C)c1C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 1/20 0.44
GABRB2 P47870 1/20 0.44
MAPT P10636 5/20 0.42
KMT2A Q03164 4/20 0.42
LMNA P02545 4/20 0.42
MEN1 O00255 2/20 0.42
TSHR P16473 1/20 0.40
TRPA1 O75762 2/20 0.36
ATM Q13315 1/20 0.36
HTT P42858 2/20 0.36
CYP3A4 P08684 3/20 0.34
ALOX15 P16050 3/20 0.34
HIF1A Q16665 3/20 0.34
CYP1A2 P05177 2/20 0.34
CYP2D6 P10635 2/20 0.34
CYP2C9 P11712 2/20 0.34
PKM P14618 2/20 0.34
CYP2C19 P33261 2/20 0.34
THRB P10828 2/20 0.34
POLB P06746 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30375425 1.00 GABRA1 (0.44) GABRA1GABRB2MAPTKMT2ALMNA
SCHEMBL8070036 0.86 TRPA1 (0.42) GABRA1GABRB2MAPTKMT2ALMNA
SCHEMBL4055507 0.83 CA1 (0.43) MAPTKMT2ALMNAMEN1TSHR
SCHEMBL7187040 0.81 GABRA1 (0.47) GABRA1GABRB2MAPTKMT2ALMNA
SCHEMBL4027621 0.81 GABRA1 (0.47) GABRA1GABRB2MAPTKMT2ALMNA
SCHEMBL5385164 0.81 GABRA1 (0.42) GABRA1GABRB2MAPTKMT2ALMNA
SCHEMBL30374777 0.81 GABRA1 (0.42) GABRA1GABRB2MAPTKMT2ALMNA
SCHEMBL835192 0.80 SLC6A2 (0.37) MAPTKMT2ALMNAMEN1TRPA1
SCHEMBL2313593 0.79 GABRA1 (0.44) GABRA1GABRB2MAPTKMT2ALMNA
SCHEMBL30149174 0.79 GABRA1 (0.44) GABRA1GABRB2MAPTKMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210139390-A1 PRODUCTION METHOD OF ORGANIC COMPOUND UNITIKA LTD. (JP) 2021-05-13 US disclosed
EP-3819283-A1 METHOD FOR PRODUCING ORGANIC COMPOUND Unitika Ltd. (JP) 2021-05-12 EP disclosed
CN-112384489-A Method for producing organic compound 尤尼吉可株式会社 2021-02-19 CN disclosed
US-7713449-B2 Polymer electrolytic material, polymer electrolytic part, membrane electrode assembly, and polymer electrolyte fuel cell TORAY INDUSTRIES, INC. (JP) 2010-05-11 US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
US-20060180796-A1 Polymer electrolyte material, polymer electrolyte part, membrane electrode composite and polymer electrolyte type fuel cell TORAY INDUSTRIES, INC. (JP) 2006-08-17 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
EP-1619735-A1 POLYMER ELECTROLYTE MATERIAL, POLYMER ELECTROLYTE PART, MEMBRANE ELECTRODE COMPOSITE AND POLYMER ELECTROLYTE TYPE FUEL CELL TORAY INDUSTRIES, INC. (JP) 2006-01-25 EP disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030062630-A1 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same HITACHI CHEMICAL CO., LTD. (JP) 2003-04-03 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed
EP-1035438-A2 Phenolic resins and photoresist compositions comprising same Shipley Company LLC (US) 2000-09-13 EP disclosed
EP-0943640-A1 HIGHLY HEAT-RESISTANT, HIGH-PURITY POLYARYLATE AND FILM PRODUCED FROM THE SAME UNITIKA LTD. (JP) 1999-09-22 EP disclosed