SCHEMBL2200512

SCHEMBL2200512

COc1cccc(C(c2c(C)cc(C)cc2O)c2c(C)cc(C)cc2O)c1O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.47
MAPT P10636 5/20 0.46
KDM4E B2RXH2 3/20 0.46
ALDH1A1 P00352 2/20 0.46
HPGD P15428 2/20 0.46
ALOX15 P16050 2/20 0.46
HSD17B10 Q99714 2/20 0.46
TP53 P04637 2/20 0.46
LMNA P02545 1/20 0.46
CYP3A4 P08684 1/20 0.46
ALOX12 P18054 1/20 0.46
MAPK1 P28482 1/20 0.46
GUSB P08236 1/20 0.41
CYP2C19 P33261 2/20 0.40
G6PD P11413 1/20 0.40
CYP2D6 P10635 1/20 0.40
BCHE P06276 1/20 0.39
TYR P14679 1/20 0.39
ACHE P22303 1/20 0.39
P4HB P07237 3/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30375550 1.00 CYP1A2 (0.47) CYP1A2MAPTKDM4EALDH1A1HPGD
SCHEMBL2200950 0.81 CYP1A2 (0.48) CYP1A2MAPTKDM4EALDH1A1HPGD
SCHEMBL30149174 0.77 GABRA1 (0.44) CYP1A2MAPTKDM4EALDH1A1TP53
SCHEMBL2313593 0.77 GABRA1 (0.44) CYP1A2MAPTKDM4EALDH1A1TP53
SCHEMBL30375446 0.77 MAPT (0.49) CYP1A2MAPTKDM4EALDH1A1HPGD
SCHEMBL278351 0.77 MAPT (0.49) CYP1A2MAPTKDM4EALDH1A1HPGD
SCHEMBL2200629 0.76 MAPT (0.47) CYP1A2MAPTKDM4EALDH1A1HPGD
SCHEMBL29908290 0.76 MAPT (0.47) CYP1A2MAPTKDM4EALDH1A1HPGD
SCHEMBL7448667 0.74 MAPT (0.57) CYP1A2MAPTKDM4EALDH1A1HPGD
SCHEMBL3863574 0.74 GAA (0.48) CYP1A2MAPTALDH1A1ALOX15ALOX12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2018-01-11 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
EP-1496395-B1 Photosensitive resin precursor composition TORAY INDUSTRIES (JP) 2012-06-20 EP disclosed
EP-1862855-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2011-10-05 EP disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
EP-1630605-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME TORAY INDUSTRIES, INC. (JP) 2006-03-01 EP disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050058937-A1 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-03-17 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US disclosed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US disclosed
EP-1146394-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION CLARIANT INTERNATIONAL LTD. (CH) 2001-10-17 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME EED, RPL19, RARA CYP1A2 2987/4885MAPT 960/4885KDM4E 1157/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA CYP1A2 2987/4885MAPT 960/4885KDM4E 1157/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.