SCHEMBL23153188

SCHEMBL23153188

CC(C)CC(C(=O)OCCCCOc1ccc(C(=O)Oc2ccc3ccc4c(C=O)ccc5ccc2c3c54)cc1)C(C)C

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PRSS1 P07477 1/20 0.33
▸ ACR P10323 1/20 0.33
▸ RARB P10826 1/20 0.33
▸ NPC1 O15118 2/20 0.32
▸ LMNA P02545 2/20 0.32
▸ CYP1A2 P05177 1/20 0.32
▸ CYP3A4 P08684 1/20 0.32
▸ CYP2D6 P10635 1/20 0.32
▸ CYP2C9 P11712 1/20 0.32
▸ CYP2C19 P33261 1/20 0.32
▸ MAPT P10636 2/20 0.32
▸ KMT2A Q03164 2/20 0.32
▸ TAS1R3 Q7RTX0 1/20 0.32
▸ TAS1R1 Q7RTX1 1/20 0.32
▸ NFKB1 P19838 1/20 0.32
▸ NFKB2 Q00653 1/20 0.32
▸ RELA Q04206 1/20 0.32
▸ SMN1; SMN2 Q16637 1/20 0.32
▸ HTT P42858 1/20 0.32
▸ L3MBTL1 Q9Y468 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23153185 0.79 LMNA (0.43) PRSS1ACRRARBNPC1LMNA
SCHEMBL23153196 0.78 MTNR1A (0.42) PRSS1ACRNPC1LMNACYP1A2
SCHEMBL23153186 0.78 NPC1 (0.44) PRSS1ACRRARBNPC1LMNA
SCHEMBL21169020 0.75 NPC1 (0.43) PRSS1ACRRARBNPC1LMNA
SCHEMBL25793413 0.73 MAPT (0.47) PRSS1ACRRARBNPC1LMNA
SCHEMBL22621670 0.73 NPC1 (0.39) PRSS1ACRNPC1LMNACYP1A2
SCHEMBL21560925 0.72 RARB (0.59) RARBHTTMAPK1TSHR
SCHEMBL21969405 0.72 MEN1 (0.34) PRSS1ACRNPC1LMNACYP1A2
SCHEMBL20781193 0.71 PRSS1 (0.43) PRSS1ACRNPC1LMNACYP1A2
SCHEMBL21969303 0.71 SENP1 (0.38) MAPTKMT2ASMN1; SMN2GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10961423-B2 Curable composition, thermally conductive material, and device with thermally conductive layer FUJIFILM CORPORATION (JP) 2021-03-30 — — US disclosed
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