SCHEMBL232216

SCHEMBL232216

[AlH2][SiH2]OC(c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 1/20 0.40
MAPK1 P28482 1/20 0.37
KCNN4 O15554 4/20 0.36
TSHR P16473 2/20 0.36
ALDH1A1 P00352 2/20 0.36
ALOX15 P16050 1/20 0.34
CYP1A2 P05177 1/20 0.30
TAAR1 Q96RJ0 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5571950 0.79 KIF11 (0.43) KIF11MAPK1KCNN4TSHRALDH1A1
SCHEMBL29569674 0.75 KIF11 (0.40) KIF11MAPK1KCNN4TSHRALDH1A1
SCHEMBL2462425 0.75 MAPK1 (0.42) KIF11MAPK1KCNN4TSHRALDH1A1
SCHEMBL1315596 0.71 MAPK1 (0.44) KIF11MAPK1KCNN4TSHRALDH1A1
SCHEMBL297786 0.69 MAPK1 (0.52) KIF11MAPK1KCNN4TSHRALDH1A1
SCHEMBL8973 0.69 KIF11 (0.48) KIF11MAPK1KCNN4TSHRALDH1A1
Ammonia Solution, Strong SCHEMBL23726528 0.67 KIF11 (0.46) KIF11MAPK1KCNN4TSHRALDH1A1
Hydrochloric Acid SCHEMBL28556207 0.67 KIF11 (0.46) KIF11MAPK1KCNN4TSHRALDH1A1
Bromide SCHEMBL28557682 0.67 KIF11 (0.46) KIF11MAPK1KCNN4TSHRALDH1A1
Methoxytriphenylmethane SCHEMBL9103 0.65 MAPK1 (0.48) KIF11MAPK1KCNN4TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11879052-B2 Curatives HEXCEL COMPOSITES LIMITED (GB) 2024-01-23 US disclosed
US-11702516-B2 Curative composition and a resin composition containing the curative composition HEXCEL COMPOSITES LIMITED (GB) 2023-07-18 US disclosed
US-20230167272-A1 IMPROVEMENTS IN OR RELATING TO CURATIVES HEXCEL COMPOSITES LIMITED (GB) 2023-06-01 US disclosed
US-20200385536-A1 A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION HEXCEL COMPOSITES LIMITED (GB) 2020-12-10 US disclosed
WO-2020216688-A1 IMPROVEMENTS IN OR RELATING TO CURATIVES HEXCEL COMPOSITES LIMITED (GB) 2020-10-29 WO disclosed
EP-3728414-A1 A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION Hexcel Composites Limited (GB) 2020-10-28 EP disclosed
US-10123412-B2 Thermosetting polymer formulations, circuit materials, and methods of use thereof ROGERS CORPORATION (US) 2018-11-06 US disclosed
US-9790400-B2 Organic-inorganic complex, and forming composition thereof NIPPON SODA CO., LTD. (JP) 2017-10-17 US disclosed
US-20170218171-A1 THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT 2017-08-03 US disclosed
WO-2017132310-A1 THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF ROGERS CORPORATION (US) 2017-08-03 WO disclosed
US-20120004349-A1 Epoxy resin composition, curing agent, and curing accelerator NIPPON SODA CO., LTD. 2012-01-05 US disclosed
US-20120004377-A1 CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR NIPPON SODA CO., LTD. 2012-01-05 US disclosed
US-20090093599-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 2009-04-09 US disclosed
US-7495060-B2 Tetrakisphenol and non-clathrated curing agent for epoxy resin NIPPON SODA CO., LTD. (JP) 2009-02-24 US disclosed
US-20060287465-A1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition NIPPON SODA CO., LTD (JP) 2006-12-21 US disclosed
EP-1520867-A2 Curatives for epoxy resin, curing accelerator, and epoxy resin composition NIPPON SODA CO., LTD. (JP) 2005-04-06 EP disclosed
EP-0949286-B1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO (JP) 2005-03-02 EP disclosed
US-20040106764-A1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition SUZUKI HIROSHI (JP) 2004-06-03 US disclosed
US-6727325-B1 HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY NIPPON SODA CO. LTD. (JP) 2004-04-27 US disclosed
EP-0949286-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 1999-10-13 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120004377-A1 CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR SEM1, RCC1, BMI1 KIF11 4363/4885MAPK1 4171/4885KCNN4 3578/4885
US-20120004349-A1 Epoxy resin composition, curing agent, and curing accelerator DCTN1, ARCN1, UNC119 KIF11 2740/4885MAPK1 4059/4885KCNN4 3751/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.