SCHEMBL232567

SCHEMBL232567

CCOC(COCCO)N(C)C

nearest known ligand 0.44

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.44
TSHR P16473 2/20 0.35
MAPK1 P28482 1/20 0.35
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
SPHK1 Q9NYA1 1/20 0.33
THRB P10828 1/20 0.32
HTT P42858 1/20 0.32
MAPT P10636 1/20 0.32
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5441240 0.83 ALDH1A1 (0.32) ALDH1A1TSHRSPHK1THRB
SCHEMBL9702134 0.82 ALDH1A1 (0.43) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL10684191 0.81 THRB (0.35) THRB
SCHEMBL5450674 0.80
SCHEMBL8865873 0.74 ALDH1A1 (0.52) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL7780205 0.74 THRB (0.33) THRB
SCHEMBL769092 0.73
SCHEMBL10605765 0.72 ALDH1A1 (0.50) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL98646 0.72 ALDH1A1 (0.50) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL29081046 0.72 ALDH1A1 (0.50) ALDH1A1TSHRMAPK1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 220 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2295438-B2 PROCESS FOR PRODUCING HYDROXYALKYLTRIETHYLENEDIAMINE COMPOUND, AND CATALYST COMPOSITION FOR THE PRODUCTION OF POLYURETHANE RESIN USING THE HYDROXYALKYLTRIETHYLENEDIAMINE COMPOUND TOSOH CORP (JP) 2025-03-26 EP claimed
EP-2295438-B1 PROCESS FOR PRODUCING HYDROXYALKYLTRIETHYLENEDIAMINE COMPOUND, AND CATALYST COMPOSITION FOR THE PRODUCTION OF POLYURETHANE RESIN USING THE HYDROXYALKYLTRIETHYLENEDIAMINE COMPOUND TOSOH CORP (JP) 2015-03-18 EP claimed
US-20110077376-A1 PROCESS FOR PRODUCING HYDROXYALKYLTRIETHYLENEDIAMINE, AND CATALYST COMPOSITION FOR THE PRODUCTION OF POLYURETHANE RESIN USING IT TOSOH CORPORATION (JP) 2011-03-31 US claimed
EP-2295438-A1 PROCESS FOR PRODUCING HYDROXYALKYLTRIETHYLENEDIAMINE COMPOUND, AND CATALYST COMPOSITION FOR THE PRODUCTION OF POLYURETHANE RESIN USING THE HYDROXYALKYLTRIETHYLENEDIAMINE COMPOUND Tosoh Corporation (JP) 2011-03-16 EP claimed
EP-0489553-B1 Photosensitive polymeric printing medium and water developable printing plates NAPP SYSTEMS INC (US) 1997-05-28 EP claimed
US-5348844-A Domains of latex and elastomer bound by photopolymerizable compounds filling interstices, flexography NAPP SYSTEMS, INC. (US) 1994-09-20 US claimed
EP-0489553-A1 Photosensitive polymeric printing medium and water developable printing plates NAPP SYSTEMS INC. (US) 1992-06-10 EP claimed
EP-4190832-B1 POLYISOCYANATE COMPOSITION, COATING COMPOSITION AND COATED SUBSTRATE ASAHI CHEMICAL IND (JP) 2026-04-08 EP disclosed
EP-3959217-B1 IMPROVEMENTS IN OR RELATING TO CURATIVES HEXCEL COMPOSITES LTD (GB) 2025-10-15 EP disclosed
US-20250270376-A1 FILM FOR LATEX INK LINTEC CORPORATION (JP) 2025-08-28 US disclosed
EP-4585594-A1 GLYCIDYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT AND MULTILAYER BODY DIC Corporation (JP) 2025-07-16 EP disclosed
EP-4328273-B1 BLOCKED ISOCYANATE COMPOSITION, AQUEOUS DISPERSION, COATING COMPOSITION AND COATING FILM ASAHI CHEMICAL IND (JP) 2025-06-25 EP disclosed
WO-2025105118-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLING METHOD DIC株式会社 2025-05-22 WO disclosed
EP-0489553-B1 Photosensitive polymeric printing medium and water developable printing plates NAPP SYSTEMS INC (US) 1997-05-28 EP disclosed
US-5348844-A Domains of latex and elastomer bound by photopolymerizable compounds filling interstices, flexography NAPP SYSTEMS, INC. (US) 1994-09-20 US disclosed
EP-0261910-B1 Water-developable photosensitive plate and its production NIPPON PAINT CO LTD (JP) 1994-03-30 EP disclosed
US-5175076-A Copolymer resin for light sensitive elements of diene, alpha, beta-unsaturated carboxylic acids and vinyl monomers, a basic nitrogen compound and an unsaturated monomer NIPPON PAINT CO., LTD. (JP) 1992-12-29 US disclosed
EP-0489553-A1 Photosensitive polymeric printing medium and water developable printing plates NAPP SYSTEMS INC. (US) 1992-06-10 EP disclosed
EP-0261910-A2 Water-developable photosensitive plate and its production Nippon Paint Co., Ltd. (JP) 1988-03-30 EP disclosed
WO-1988002135-A1 WATER-DEVELOPABLE PHOTOSENSITIVE PLATE AND ITS PRODUCTION NAPP SYSTEMS (USA), INC. (US) 1988-03-24 WO disclosed