SCHEMBL2336864

SCHEMBL2336864

CCOC(=O)ONC(N)=O

nearest known ligand 0.55

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.55
ALOX15 P16050 1/20 0.50
SOAT1 P35610 1/20 0.50
MGAM O43451 1/20 0.44
GAA P10253 1/20 0.44
SI P14410 1/20 0.44
MGAM2 Q2M2H8 1/20 0.44
LMNA P02545 1/20 0.40
HSD17B10 Q99714 1/20 0.40
CAD P27708 1/20 0.40
MAPT P10636 1/20 0.36
MAPK1 P28482 1/20 0.36
TRPA1 O75762 1/20 0.36
CYP1A2 P05177 1/20 0.35
PKM P14618 2/20 0.35
KDM4E B2RXH2 1/20 0.35
CRBN Q96SW2 1/20 0.35
THRB P10828 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene SCHEMBL9632404 0.96 ALDH1A1 (0.50) ALDH1A1ALOX15SOAT1MGAMGAA
SCHEMBL668543 0.85 ALOX15 (0.44) ALDH1A1ALOX15SOAT1MGAMGAA
SCHEMBL15573953 0.84 ALDH1A1 (0.52) ALDH1A1ALOX15SOAT1MGAMGAA
SCHEMBL27729339 0.82 ALDH1A1 (0.39) ALDH1A1ALOX15LMNAHSD17B10MAPT
SCHEMBL9993863 0.81 ALDH1A1 (0.55) ALDH1A1ALOX15SOAT1MGAMGAA
SCHEMBL10343186 0.80 ALDH1A1 (0.48) ALDH1A1ALOX15SOAT1MGAMGAA
SCHEMBL15521894 0.79 RAB9A (0.50) ALDH1A1LMNAMAPTCYP1A2
SCHEMBL10840657 0.78
SCHEMBL28969931 0.77 ALDH1A1 (0.50) ALDH1A1ALOX15SOAT1MGAMGAA
SCHEMBL7388385 0.77 ALDH1A1 (0.63) ALDH1A1ALOX15SOAT1MGAMGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1645909-B1 Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film SHINETSU CHEMICAL CO (JP) 2011-08-24 EP disclosed
US-7485405-B2 Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-02-03 US disclosed
US-20060079658-A1 Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film SHIN-ETSU CHEMICAL CO., LTD. 2006-04-13 US disclosed
EP-1645909-A2 Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film Shin-Etsu Chemical Co., Ltd. (JP) 2006-04-12 EP disclosed