SCHEMBL23522757

SCHEMBL23522757

C=Cc1ccc(CC2=CC=CC2)cc1

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 2/20 0.39
▸ HDAC8 Q9BY41 1/20 0.31
▸ TSHR P16473 1/20 0.31
▸ SLC5A1 P13866 1/20 0.31
▸ SLC5A2 P31639 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11554501 0.84 ALDH1A1 (0.32) ALDH1A1TSHR
SCHEMBL12815569 0.77 IDO1 (0.38) ALDH1A1
SCHEMBL2836936 0.75 CALM1 (0.46) ALDH1A1TSHR
SCHEMBL50300 0.73 ALDH1A1 (0.65) ALDH1A1HDAC8TSHRSLC5A1SLC5A2
SCHEMBL9143779 0.73 CALM1 (0.44) TSHR
SCHEMBL9144956 0.73 CALM1 (0.44) TSHR
SCHEMBL12814968 0.73 MGAM (0.31) —
SCHEMBL3618835 0.72 ALDH1A1 (0.44) ALDH1A1HDAC8TSHRSLC5A1SLC5A2
SCHEMBL7931720 0.71 TAAR1 (0.40) ALDH1A1
SCHEMBL3993707 0.71 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11639410-B2 Heat-curable resin composition and uses thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-02 — — US disclosed
US-20210189043-A1 HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-06-24 — — US disclosed
CN-113004462-A Thermosetting resin composition and use thereof 信越化学工业株式会社 2021-06-22 — — CN disclosed
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