SCHEMBL2355142

SCHEMBL2355142

CCC(C)(C)OC(=O)C(C)C

nearest known ligand 0.37

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.36
TSHR P16473 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
CYP3A4 P08684 2/20 0.35
CYP1A2 P05177 1/20 0.35
CYP2D6 P10635 1/20 0.35
CYP2C9 P11712 1/20 0.35
NFKB1 P19838 1/20 0.35
CYP2C19 P33261 1/20 0.35
LMNA P02545 1/20 0.34
PMP22 Q01453 1/20 0.34
NLRP3 Q96P20 1/20 0.34
MMP8 P22894 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27829186 0.84 ALDH1A1 (0.35) ALDH1A1TSHRTDP1CYP3A4CYP1A2
SCHEMBL4106615 0.83 CYP1A2 (0.33) ALDH1A1CYP1A2CYP2D6CYP2C19LMNA
SCHEMBL12872687 0.82
SCHEMBL12873254 0.82 MMP8 (0.30) MMP8
SCHEMBL8860901 0.82 CYP3A4 (0.33) ALDH1A1TSHRTDP1CYP3A4CYP1A2
SCHEMBL12687082 0.82 CYP3A4 (0.33) ALDH1A1TSHRTDP1CYP3A4CYP1A2
SCHEMBL9608672 0.82 LMNA (0.39) ALDH1A1TSHRTDP1CYP3A4CYP1A2
SCHEMBL19236697 0.82 CYP3A4 (0.51) ALDH1A1TSHRTDP1CYP3A4CYP1A2
SCHEMBL28528261 0.82 CYP3A4 (0.51) ALDH1A1TSHRTDP1CYP3A4CYP1A2
SCHEMBL786077 0.82 CYP3A4 (0.33) ALDH1A1TSHRTDP1CYP3A4CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11914300-B2 Manufacturing method of semiconductor chip, and kit FUJIFILM CORPORATION (JP) 2024-02-27 US disclosed
US-11773266-B2 Polymer, molded body, foam, resin composition, and production method for polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-10-03 US disclosed
US-20230129965-A1 HYDROPHILIC AND OLEOPHOBIC POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-04-27 US disclosed
CN-110079244-A A kind of solar cell package material, related glue film and solar cell module 杭州福斯特应用材料股份有限公司 2019-08-02 CN disclosed
CN-109952360-A Quantum dot dispersion liquid, self-luminous photosensitive polymer combination, the colour filter and image display device manufactured using it 东友精细化工有限公司 2019-06-28 CN disclosed
CN-107112841-B Thermosetting resin composition and rotating electrical machine using the same 日立汽车系统株式会社 2019-05-31 CN disclosed
US-20180217503-A1 TREATMENT LIQUID AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2018-08-02 US disclosed
US-20180171171-A1 COATINGS P2I LTD. (GB) 2018-06-21 US disclosed
US-9915870-B2 Pattern forming method, composition kit and resist film, and method for producing electronic device using them, and electronic device FUJIFILM CORPORATION (JP) 2018-03-13 US disclosed
US-20180030175-A1 POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-02-01 US disclosed
US-20110195362-A1 RESIST UNDERLAYER FILM COMPOSITION, PROCESS FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS AND FULLERENE DERIVATIVE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-08-11 US disclosed
EP-2349974-A1 PROCESS FOR THE PREPARATION OF ACYLATED SECONDARY ALCOHOL ALKOXYLATES AND SECONDARY ALCOHOL ALKOXYLATES Shell Internationale Research Maatschappij B.V. (NL) 2011-08-03 EP disclosed
US-20110091809-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2011-04-21 US disclosed
US-20100323305-A1 PATTERN FORMING METHOD, RESIST COMPOSITION FOR MULTIPLE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, DEVELOPER FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2010-12-23 US disclosed
US-20100239978-A1 PHOTOSENSITIVE COMPOSITION, AND PATTERN-FORMING METHOD AND RESIST FILM USING THE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2010-09-23 US disclosed
US-20100209848-A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-19 US disclosed
US-20100159389-A1 RESIN, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-06-24 US disclosed
WO-2010049465-A1 PROCESS FOR THE PREPARATION OF ACYLATED SECONDARY ALCOHOL ALKOXYLATES AND SECONDARY ALCOHOL ALKOXYLATES SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V. (NL) 2010-05-06 WO disclosed
EP-2181763-A1 Catalyst and process for alkoxylation Shell Internationale Research Maatschappij B.V. (NL) 2010-05-05 EP disclosed
US-7465529-B2 Radiation sensitive material and method for forming pattern FUJITSU LIMITED (JP) 2008-12-16 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110195362-A1 RESIST UNDERLAYER FILM COMPOSITION, PROCESS FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS AND FULLERENE DERIVATIVE PARG, TOP2A, FRG1 ALDH1A1 3305/4885TSHR 4521/4885TDP1 2770/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.