Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TYR | P14679 | 2/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11874166 | 0.80 | XDH (0.33) | — | |
| SCHEMBL8577488 | 0.75 | TYR (0.50) | TYR | |
| SCHEMBL22278955 | 0.75 | TYR (0.50) | TYR | |
| SCHEMBL10706691 | 0.75 | TYR (0.40) | TYR | |
| SCHEMBL387118 | 0.74 | GABRA1 (0.48) | — | |
| SCHEMBL28642768 | 0.72 | TYR (0.52) | TYR | |
| SCHEMBL13730991 | 0.72 | TYR (0.57) | TYR | |
| SCHEMBL950881 | 0.71 | TYR (0.57) | TYR | |
| SCHEMBL15452247 | 0.71 | TYR (0.57) | TYR | |
| SCHEMBL31618874 | 0.71 | TYR (0.57) | TYR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110207326-A1 | SLURRY FOR POLISHING AND PLANARIZATION METHOD OF INSULATING LAYER USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-08-25 | — | — | US | claimed |
| CN-106867411-B | Slurry composition for chemical mechanical polishing, method for producing the same, polishing method, method for manufacturing semiconductor device, and polishing apparatus | 三星电子株式会社 | 2021-04-06 | — | — | CN | disclosed |
| US-10829690-B2 | Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-11-10 | — | — | US | disclosed |
| CN-110872472-A | Slurry composition, method of preparing the same, and method of manufacturing semiconductor device using the same | 三星电子株式会社 | 2020-03-10 | — | — | CN | disclosed |
| US-20200071613-A1 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE BY USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-03-05 | — | — | US | disclosed |
| US-20170107404-A1 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING THE SAME, AND POLISHING METHOD USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2017-04-20 | — | — | US | disclosed |
| US-8546261-B2 | Slurry for polishing and planarization method of insulating layer using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-10-01 | — | — | US | disclosed |
| US-20110207326-A1 | SLURRY FOR POLISHING AND PLANARIZATION METHOD OF INSULATING LAYER USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-08-25 | — | — | US | disclosed |