Known targets — ChEMBL curated mechanism
FGFR1FGFR2FGFR3FGFR4FLT1FLT4KDRPDGFRAPDGFRB
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BBOX1 | O75936 | 3/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 3/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.33 |
| ▸ | TP53 | P04637 | 2/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | GMNN | O75496 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | THPO | P40225 | 1/20 | 0.33 |
| ▸ | HBB | P68871 | 1/20 | 0.33 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | RECQL | P46063 | 2/20 | 0.32 |
| ▸ | GLA | P06280 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Zinc Ion SCHEMBL428649 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL9001604 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL20533678 | 0.91 | — | — | |
| SCHEMBL1552464 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL20583852 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL20533681 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL22581623 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL20533647 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL19809549 | 0.91 | BBOX1 (0.38) | BBOX1KDM4EMAPTALOX15TSHR | |
| SCHEMBL6915790 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 251 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024131535-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| WO-2024131536-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| CN-118241267-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-118241266-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-117684223-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-117684222-A | Metal electroplating composition for electrolytic copper coating and application method thereof | 宁波安集微电子科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| WO-2024046450-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-03-07 | — | — | WO | claimed |
| WO-2024046447-A1 | METAL ELECTROPLATING COMPOSITION FOR ELECTROLYTIC COPPER COATING AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-03-07 | — | — | WO | claimed |
| CN-112725851-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| CN-112746292-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| US-11332471-B2 | Leveling agent, metal plating composition containing same, preparation method therefor and use thereof | SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) | 2022-05-17 | — | — | US | claimed |
| CN-112795960-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-14 | — | — | CN | claimed |
| CN-112760683-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-07 | — | — | CN | claimed |
| CN-112746292-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-04 | — | — | CN | claimed |
| CN-112725850-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-04-30 | — | — | CN | claimed |
| CN-112725851-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-04-30 | — | — | CN | claimed |
| CN-111218686-A | Etching liquid composition | 易安爱富科技有限公司 | 2020-06-02 | — | — | CN | claimed |
| EP-1338031-A2 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORPORATION (US) | 2003-08-27 | — | — | EP | claimed |
| WO-2002045142-A9 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORP (US) | 2003-02-06 | — | — | WO | claimed |
| WO-2002045142-A2 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORPORATION (US) | 2002-06-06 | — | — | WO | claimed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11332471-B2 | Leveling agent, metal plating composition containing same, preparation method therefor and use thereof | PRPF8, CACNA1F, ATP1B2 | BBOX1 3223/4885KDM4E 3340/4885MAPT 2766/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.