⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1055776 | 0.80 | TET3 (0.30) | — | |
| SCHEMBL27962277 | 0.78 | DRD4 (0.31) | — | |
| SCHEMBL28026738 | 0.78 | DRD4 (0.30) | — | |
| SCHEMBL29035536 | 0.75 | — | — | |
| SCHEMBL23748538 | 0.74 | TSHR (0.33) | — | |
| SCHEMBL27767618 | 0.74 | — | — | |
| SCHEMBL7926950 | 0.73 | — | — | |
| SCHEMBL27898023 | 0.71 | TET3 (0.30) | — | |
| SCHEMBL28269509 | 0.71 | — | — | |
| SCHEMBL2048192 | 0.69 | OPRM1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024190725-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2024-09-19 | — | — | WO | disclosed |
| US-11993715-B2 | Low compression set silicon rubber composition | MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) | 2024-05-28 | — | — | US | disclosed |
| US-11908595-B2 | Use of a silicone rubber composition for the manufacture of an insulator for high voltage direct current applications | MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) | 2024-02-20 | — | — | US | disclosed |
| EP-2542624-B2 | USE OF A CURABLE POLYORGANOSILOXANE COMPOSITION AS AN ENCAPSULANT FOR A SOLAR CELL MODULE | MOMENTIVE PERFORMANCE MAT GMBH (DE) | 2024-01-10 | — | — | EP | disclosed |
| US-20230383067-A1 | NON-CURABLE SILICONE COMPOSITION COMPRISING CARBON BLACK | MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) | 2023-11-30 | — | — | US | disclosed |
| WO-2023227714-A1 | NEW SUBSTITUTED PHOSPHITE TRANSITION METAL COMPOUNDS | MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) | 2023-11-30 | — | — | WO | disclosed |
| CN-116830217-A | Non-curable silicone composition comprising carbon black | 迈图高新材料有限责任公司 | 2023-09-29 | — | — | CN | disclosed |
| EP-4233078-A1 | NON-CURABLE SILICONE COMPOSITION COMPRISING CARBON BLACK | Momentive Performance Materials GmbH (DE) | 2023-08-30 | — | — | EP | disclosed |
| EP-2879808-B1 | PROCESS FOR THE MANUFACTURE OF A MULTILAYER SILICONE STRUCTURE | MOMENTIVE PERFORMANCE MAT GMBH (DE) | 2023-07-26 | — | — | EP | disclosed |
| CN-112739787-B | Functional polysiloxanes | 迈图高新材料有限责任公司 | 2023-07-25 | — | — | CN | disclosed |
| EP-1699897-A2 | CURABLE SILOXANE COMPOSITION WITH MODIFIED SURFACE PROPERTIES | GE Bayer Silicones GmbH & Co. KG (DE) | 2006-09-13 | — | — | EP | disclosed |
| WO-2005063890-A2 | CURABLE SILOXANE COMPOSITION WITH MODIFIED SURFACE PROPERTIES | GE BAYER SILICONES GMBH & CO. KG (DE) | 2005-07-14 | — | — | WO | disclosed |
| WO-2005054394-A2 | CURABLE SILICONE PRESSURE ADHESIVE COATING COMPOSITIONS | GENERAL ELECTRIC COMPANY (US) | 2005-06-16 | — | — | WO | disclosed |
| US-20050113513-A1 | Curable silicone pressure adhesive coating compositions | GENERAL ELECTRIC COMPANY | 2005-05-26 | — | — | US | disclosed |
| US-5602214-A | CONTAINING POLYSILOXANE, SILICONE GUM AND SILICONE FLUID; HIGH TACK, QUICK STICK, PEEL STRENGTH | GENERAL ELECTRIC COMPANY (US) | 1997-02-11 | — | — | US | disclosed |
| US-5580915-A | CURABLE BLEND OF SOLID SILICON COPOLYMERS, SILICONE GUMS AND FLUIDS, FOR PRESSURE SENSITIVE ADHESIVES HAVING RESIDUE-FREE REMOVAL | GENERAL ELECTRIC COMPANY (US) | 1996-12-03 | — | — | US | disclosed |
| US-5576110-A | PRESSURE SENSITIVE ADHESIVES | GENERAL ELECTRIC COMPANY (US) | 1996-11-19 | — | — | US | disclosed |
| EP-0506370-B1 | Silicone pressure sensitive adhesive compositions having high solids content | GEN ELECTRIC (US) | 1995-11-15 | — | — | EP | disclosed |
| US-5190827-A | Curable polysiloxanes on supports for adhesive tapes | GENERAL ELECTRIC COMPANY (US) | 1993-03-02 | — | — | US | disclosed |
| EP-0506370-A2 | Silicone pressure sensitive adhesive compositions having high solids content | GENERAL ELECTRIC COMPANY (US) | 1992-09-30 | — | — | EP | disclosed |