SCHEMBL2373718

SCHEMBL2373718

c1ccc(-c2cccc3c2-c2ccccc2-3)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.46
HSD17B10 Q99714 3/20 0.46
MAPK1 P28482 2/20 0.46
HPGD P15428 1/20 0.46
BCL2L1 Q07817 1/20 0.46
CYP2A6 P11509 1/20 0.46
HNF4A P41235 1/20 0.45
HDAC4 P56524 1/20 0.44
HDAC2 Q92769 1/20 0.44
HDAC8 Q9BY41 1/20 0.44
HDAC6 Q9UBN7 1/20 0.44
BACE1 P56817 1/20 0.42
DPP4 P27487 1/20 0.41
PDCD1 Q15116 1/20 0.40
CD274 Q9NZQ7 1/20 0.40
LMNA P02545 2/20 0.39
MAPT P10636 2/20 0.39
TDP1 Q9NUW8 1/20 0.38
BCAT2 O15382 1/20 0.38
PLK4 O00444 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30395776 1.00 ALDH1A1 (0.46) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
SCHEMBL2167186 1.00 ALDH1A1 (0.46) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
Hydrogen Sulfide SCHEMBL27549591 0.97 ALDH1A1 (0.44) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
Phosphine SCHEMBL27403569 0.97 ALDH1A1 (0.44) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
SCHEMBL29108665 0.95 ALDH1A1 (0.45) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
SCHEMBL30355086 0.94 ALDH1A1 (0.46) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
SCHEMBL11762758 0.94 ALDH1A1 (0.46) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
SCHEMBL7922689 0.93 HNF4A (0.45) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
SCHEMBL2422115 0.92 ALDH1A1 (0.48) ALDH1A1HSD17B10MAPK1HPGDBCL2L1
SCHEMBL6800360 0.91 ALDH1A1 (0.44) ALDH1A1HSD17B10MAPK1HPGDBCL2L1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116194845-A Photomask, exposure method, method for producing resin pattern, and method for producing photomask 富士胶片株式会社 2023-05-30 CN disclosed
WO-2023074680-A1 CONDUCTIVE RESIN COMPOSITION サカタインクス株式会社 2023-05-04 WO disclosed
CN-115702134-A Process for producing cyclic olefin compound 三井化学株式会社 2023-02-14 CN disclosed
WO-2022202333-A1 PHENOLIC RESIN MIXTURE, AND CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2022-09-29 WO disclosed
WO-2022202335-A1 PHENOLIC RESIN MIXTURE, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 日本化薬株式会社 2022-09-29 WO disclosed
CN-106243646-B Liquid-crystalline polyester composition and formed body 住友化学株式会社 2018-07-06 CN disclosed
US-20170110231-A1 SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM NITTO DENKO CORPORATION (JP) 2017-04-20 US disclosed
EP-3151253-A1 SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM Nitto Denko Corporation (JP) 2017-04-05 EP disclosed
CN-106243646-A Liquid-crystalline polyester composition and formed body 住友化学株式会社 2016-12-21 CN disclosed
CN-104507927-A Cyclic azine compound, method for producing same, and organic electroluminescent element containing same TOSOH CORP 2015-04-08 CN disclosed
WO-2015023001-A1 NOVEL ORGANOPOLYSILOXANE, SURFACE TREATMENT AGENT COMPRISING THE SAME, RESIN COMPOSITION COMPRISING THE SAME, AND GELATINOUS PRODUCT OR CURED PRODUCT THEREOF DOW CORNING TORAY CO., LTD. (JP) 2015-02-19 WO disclosed
EP-2627700-A1 POLYMER COMPOSITIONS COMPRISING POLY(ARYLETHER KETONE)S AND GRAPHENE MATERIALS SOLVAY SA (BE) 2013-08-21 EP disclosed
EP-2553011-A1 POLYMER COMPOSITIONS COMPRISING CORE/SHELL PARTICLES SOLVAY SA (BE) 2013-02-06 EP disclosed
WO-2012049121-A1 POLYMER COMPOSITIONS COMPRISING POLY(ARYLETHER KETONE)S AND GRAPHENE MATERIALS SOLVAY SA (BE) 2012-04-19 WO disclosed
WO-2011117410-A1 POLYMER COMPOSITIONS COMPRISING CORE/SHELL PARTICLES SOLVAY SA (BE) 2011-09-29 WO disclosed
US-5563230-A POLYETHERSILOXANES NATIONAL SCIENCE COUNCIL (TW) 1996-10-08 US disclosed
US-5388328-A Forming metal layer, forming resist, filling windows in resist with conductor by plating, forming another windowed resist, filling windows with conductor, dissolving resist, filling spacings with varnish, curing HITACHI, LTD. (JP) 1995-02-14 US disclosed
US-5300735-A Interconnected multilayer boards and fabrication processes thereof HITACHI, LTD. (JP) 1994-04-05 US disclosed