SCHEMBL23754643

SCHEMBL23754643

C=C(C)C(=O)OCCC[CH]CCCOC(=O)C(=C)C

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.60
THRB P10828 1/20 0.57
POLB P06746 1/20 0.45
APEX1 P27695 1/20 0.45
HTT P42858 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
ALDH1A1 P00352 8/20 0.40
HPGD P15428 1/20 0.35
CYP3A4 P08684 1/20 0.34
ATM Q13315 1/20 0.33
GLO1 Q04760 1/20 0.32
LMNA P02545 1/20 0.31
HSD17B10 Q99714 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CYP2D6 P10635 1/20 0.30
CYP2C19 P33261 1/20 0.30
MGAM O43451 1/20 0.30
GAA P10253 1/20 0.30
SI P14410 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7715736 0.93 TSHR (0.62) TSHRTHRBPOLBAPEX1HTT
SCHEMBL5836895 0.92 TSHR (0.67) TSHRTHRBPOLBAPEX1HTT
SCHEMBL8699776 0.92 TSHR (0.67) TSHRTHRBPOLBAPEX1HTT
SCHEMBL9170446 0.92 TSHR (0.67) TSHRTHRBPOLBAPEX1HTT
SCHEMBL7052595 0.91 TSHR (0.51) TSHRTHRBPOLBAPEX1HTT
SCHEMBL27735819 0.91 TSHR (0.71) TSHRTHRBPOLBAPEX1HTT
SCHEMBL5689405 0.90 TSHR (0.59) TSHRTHRBPOLBAPEX1HTT
SCHEMBL5686979 0.89 TSHR (0.74) TSHRTHRBPOLBAPEX1HTT
SCHEMBL5686970 0.89 TSHR (0.74) TSHRTHRBPOLBAPEX1HTT
SCHEMBL2917316 0.88 TSHR (0.49) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021161963-A1 CONDUCTIVE ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 昭和電工マテリアルズ株式会社 2021-08-19 WO disclosed
WO-2021161964-A1 CONDUCTIVE ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING IMAGING MODULE 昭和電工マテリアルズ株式会社 2021-08-19 WO disclosed