SCHEMBL2382143

SCHEMBL2382143

CCC(C)c1ccc(O)c(O)c1O

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 1/20 0.57
▸ RORC P51449 1/20 0.52
▸ USP2 O75604 1/20 0.44
▸ ALDH1A1 P00352 1/20 0.44
▸ GAA P10253 1/20 0.44
▸ PKM P14618 1/20 0.44
▸ HPGD P15428 1/20 0.44
▸ ALOX15 P16050 1/20 0.44
▸ HSD17B10 Q99714 1/20 0.44
▸ ADRB2 P07550 2/20 0.39
▸ ADRB1 P08588 1/20 0.39
▸ ADRB3 P13945 1/20 0.39
▸ HDAC4 P56524 1/20 0.38
▸ HDAC2 Q92769 1/20 0.38
▸ HDAC8 Q9BY41 1/20 0.38
▸ ADRA2A P08913 2/20 0.37
▸ ADRA2B P18089 2/20 0.37
▸ ADRA2C P18825 2/20 0.37
▸ ADRA1A P35348 2/20 0.37
▸ ADRA1B P35368 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21767240 0.84 TSHR (0.54) TSHRRORCUSP2ALDH1A1GAA
SCHEMBL10997664 0.83 TSHR (0.53) TSHRRORCUSP2ALDH1A1GAA
SCHEMBL28987486 0.83 ADRB2 (0.39) TSHRRORCHPGDADRB2ADRB1
SCHEMBL2976451 0.83 ADRB2 (0.46) TSHRRORCUSP2ALDH1A1GAA
SCHEMBL272404 0.82 BCHE (0.46) TSHRRORCADRB2ADRB1ADRB3
SCHEMBL28269343 0.82 GABRA1 (0.39) TSHRRORCADRB2ADRB1ADRB3
SCHEMBL2784586 0.81 TSHR (0.73) TSHRRORCUSP2ALDH1A1GAA
SCHEMBL22854146 0.79 TSHR (0.39) TSHRRORCUSP2ALDH1A1GAA
SCHEMBL560346 0.77 TSHR (0.68) TSHRRORCUSP2ALDH1A1GAA
SCHEMBL560318 0.77 TSHR (0.68) TSHRRORCUSP2ALDH1A1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8012676-B2 Process for preparing conductive material MITSUBISHI PAPER MILLS LIMITED (JP) 2011-09-06 — — US disclosed
US-20090233237-A1 Process For Preparing Conductive Material MITSUBISHI PAPER MILLS LIMITED (JP) 2009-09-17 — — US disclosed
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