SCHEMBL272404

SCHEMBL272404

CCC(c1ccc(O)c(O)c1O)c1ccc(O)c(O)c1O

nearest known ligand 0.48

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ BCHE P06276 2/20 0.46
▸ TYR P14679 2/20 0.46
▸ ACHE P22303 2/20 0.46
▸ TSHR P16473 1/20 0.40
▸ ADRA2A P08913 2/20 0.39
▸ ADRA2B P18089 2/20 0.39
▸ ADRA2C P18825 2/20 0.39
▸ ADRA1A P35348 2/20 0.39
▸ ADRB2 P07550 2/20 0.39
▸ ADRA1B P35368 1/20 0.39
▸ HKDC1 Q2TB90 1/20 0.38
▸ SELL P14151 1/20 0.38
▸ SELP P16109 1/20 0.38
▸ RORC P51449 1/20 0.37
▸ ADRB1 P08588 1/20 0.37
▸ ADRB3 P13945 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27693835 0.82 TYR (0.39) BCHETYRACHETSHR
SCHEMBL2382143 0.82 TSHR (0.57) BCHETYRACHETSHRADRA2A
SCHEMBL2976451 0.82 ADRB2 (0.46) BCHETYRACHETSHRADRA2A
SCHEMBL22854146 0.79 TSHR (0.39) BCHETYRACHETSHRADRA2A
SCHEMBL11686897 0.77 TYR (0.39) BCHETYRACHETSHRADRA1A
SCHEMBL3914426 0.76 BCHE (0.41) BCHETYRACHETSHRADRA1A
SCHEMBL9158036 0.76 TYR (0.42) TYR
SCHEMBL9614891 0.75 ADRB2 (0.39) TYRTSHRADRA2AADRA2BADRA2C
SCHEMBL487169 0.75 GABRA1 (0.56) TYRTSHRADRA2AADRA2BADRA2C
SCHEMBL5391166 0.74 ALDH1A1 (0.39) BCHETYRACHEADRA2AADRA2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 206 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 — — EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 — — WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 — — US claimed
JP-3164740-A — — None — — JP disclosed
US-12547074-B2 Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element RESONAC CORPORATION (JP) 2026-02-10 — — US disclosed
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 — — US disclosed
US-12405198-B2 Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device RESONAC CORPORATION (JP) 2025-09-02 — — US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 — — US disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 — — EP disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 — — EP disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 — — EP disclosed
EP-1028354-A1 Positive photosensitive resin composition, method of forming relief pattern, and electronic part Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2000-08-16 — — EP disclosed
EP-0961169-A1 Photosensitive polymer composition, method for forming relief patterns, and electronic parts Hitachi Chemical DuPont MicroSystems Ltd. (JP) 1999-12-01 — — EP disclosed
US-5985507-A PHOTORESISTS WITH THERMAL PROPERTIES OLIN MICROELECTRONIC CHEMICALS, INC. (US) 1999-11-16 — — US disclosed
EP-0753795-B1 Positive working photoresist composition FUJI PHOTO FILM CO LTD (JP) 1999-10-13 — — EP disclosed
WO-1999042507-A1 SELECTED HIGH THERMAL NOVOLAKS AND POSITIVE-WORKING RADIATION-SENSITIVE COMPOSITIONS OLIN MICROELECTRONIC CHEMICALS, INC. (US) 1999-08-26 — — WO disclosed
EP-0863436-A1 Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device HITACHI CHEMICAL CO., LTD. (JP) 1998-09-09 — — EP disclosed
EP-0684521-B1 Positive working photosensitive compositions FUJI PHOTO FILM CO LTD (JP) 1998-01-14 — — EP disclosed
US-5674657-A PHENOLIC RESIN COPOLYMER COMPRISING META-CRESOL, PARA-CRESOL AND OTHER PHENOLIC MONOMER SELECTED FROM XYLENOLS, METHOXYPHENOLS; RADIATION SENSITIVITY OLIN MICROELECTRONIC CHEMICALS, INC. (US) 1997-10-07 — — US disclosed
JP-H03164740-A POSITIVE TYPE PHOTORESIST COMPOSITION AND MANUFACTURE OF RESIST PATTERN HITACHI CHEM CO LTD 1991-07-16 — — JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12547074-B2 Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element JMJD6, RARA, BCR BCHE 3360/4885TYR 123/4885ACHE 3890/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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