⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4639751 | 0.74 | SMN1; SMN2 (0.39) | — | |
| SCHEMBL11742465 | 0.73 | KEAP1 (0.31) | — | |
| SCHEMBL238491 | 0.71 | — | — | |
| SCHEMBL29082882 | 0.71 | — | — | |
| SCHEMBL3000331 | 0.71 | CYP1A2 (0.40) | — | |
| SCHEMBL855253 | 0.71 | — | — | |
| SCHEMBL15914733 | 0.71 | — | — | |
| SCHEMBL29010804 | 0.71 | — | — | |
| SCHEMBL8577284 | 0.69 | CYP1A2 (0.30) | — | |
| SCHEMBL31352036 | 0.69 | ALDH1A1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 229 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2550562-B1 | PATTERN FORMING METHOD AND RESIST COMPOSITION | FUJIFILM CORP (JP) | 2021-04-21 | — | — | EP | disclosed |
| EP-2539769-B1 | PATTERN FORMING METHOD AND RESIST COMPOSITION | FUJIFILM CORP (JP) | 2021-04-07 | — | — | EP | disclosed |
| CN-105051610-B | Pattern forming method and method for manufacturing electronic component | 富士胶片株式会社 | 2020-02-14 | — | — | CN | disclosed |
| EP-2681623-B1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM | FUJIFILM CORP (JP) | 2019-07-10 | — | — | EP | disclosed |
| US-20190196328-A1 | PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION | FUJIFILM CORPORATION (JP) | 2019-06-27 | — | — | US | disclosed |
| EP-2434343-B1 | Resist composition, resist film therefrom and method of forming pattern therewith | FUJIFILM CORP (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-10248019-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film | FUJIFILM CORPORATION (JP) | 2019-04-02 | — | — | US | disclosed |
| US-10126651-B2 | Pattern forming method, and, method for producing electronic device and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2018-11-13 | — | — | US | disclosed |
| US-10126653-B2 | Pattern forming method and resist composition | FUJIFILM CORPORATION (JP) | 2018-11-13 | — | — | US | disclosed |
| US-9952509-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2018-04-24 | — | — | US | disclosed |
| WO-2011087144-A1 | PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-07-21 | — | — | WO | disclosed |
| WO-2011083872-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-07-14 | — | — | WO | disclosed |
| US-20110091809-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2011-04-21 | — | — | US | disclosed |
| WO-2011043481-A1 | PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-04-14 | — | — | WO | disclosed |
| WO-2011024734-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2011-03-03 | — | — | WO | disclosed |
| US-20110008731-A1 | ACTINIC-RAY-OR RADIATION-SENSITIVE RESIN COMPOSITION, COMPOUND AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2011-01-13 | — | — | US | disclosed |
| WO-2010140709-A1 | METHOD OF FORMING PATTERN USING ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, AND PATTERN | FUJIFILM CORPORATION (JP) | 2010-12-09 | — | — | WO | disclosed |
| US-20100255418-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN THEREWITH | FUJIFILM CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| US-20100248136-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2010-09-30 | — | — | US | disclosed |
| WO-2010061977-A2 | PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2010-06-03 | — | — | WO | disclosed |