SCHEMBL23854471

SCHEMBL23854471

CCCC(C)(CC)C(=O)N(CC1CCCCC1)c1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(N(CC3CCCCC3)C(=O)C(C)(CC)CCC)c2F)c1F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL483133 0.94
SCHEMBL483322 0.92 HDAC3 (0.30)
SCHEMBL483253 0.89
SCHEMBL482715 0.85
SCHEMBL23854472 0.83 HDAC3 (0.30)
SCHEMBL482617 0.80 HDAC1 (0.36)
SCHEMBL482927 0.80
SCHEMBL598466 0.79 PDK1 (0.33)
SCHEMBL483362 0.79 MLYCD (0.31)
SCHEMBL483167 0.79 PPARG (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed