Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BCHE | P06276 | 2/20 | 0.49 |
| ▸ | TYR | P14679 | 2/20 | 0.49 |
| ▸ | ACHE | P22303 | 2/20 | 0.49 |
| ▸ | GAA | P10253 | 2/20 | 0.48 |
| ▸ | TSHR | P16473 | 2/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.48 |
| ▸ | BLM | P54132 | 2/20 | 0.47 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.47 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.46 |
| ▸ | NQO1 | P15559 | 1/20 | 0.43 |
| ▸ | SLC22A3 | O75751 | 1/20 | 0.43 |
| ▸ | MAOB | P27338 | 1/20 | 0.42 |
| ▸ | GUSB | P08236 | 1/20 | 0.41 |
| ▸ | MGAM | O43451 | 1/20 | 0.41 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2203378 | 0.86 | ALDH1A1 (0.53) | BCHETYRACHEGAATSHR | |
| SCHEMBL2202257 | 0.83 | TDP1 (0.40) | TSHRCYP3A4BLMNFKB1NPSR1 | |
| SCHEMBL30044816 | 0.83 | TDP1 (0.40) | TSHRCYP3A4BLMNFKB1NPSR1 | |
| SCHEMBL28340143 | 0.82 | TSHR (0.50) | BCHETYRACHEGAATSHR | |
| SCHEMBL2203108 | 0.81 | TSHR (0.53) | BCHETYRACHEGAATSHR | |
| SCHEMBL29695982 | 0.81 | TSHR (0.53) | BCHETYRACHEGAATSHR | |
| SCHEMBL2992166 | 0.80 | ALOX5 (0.45) | GAATSHRCYP3A4NQO1MEN1 | |
| SCHEMBL20563424 | 0.79 | TSHR (0.65) | BCHETYRACHEGAATSHR | |
| SCHEMBL12415057 | 0.78 | UGT2B7 (0.35) | CYP3A4NQO1MEN1KMT2A | |
| SCHEMBL2865089 | 0.78 | TSHR (0.56) | BCHETYRACHEGAATSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5738968-A | Positive photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-04-14 | — | — | US | claimed |
| JP-9319083-A | — | — | None | — | — | JP | disclosed |
| JP-9319078-A | — | — | None | — | — | JP | disclosed |
| US-8026047-B2 | Providing film on substrate, forming resist pattern on film through lithography technique including exposure and development, and performing processing in which film is brought into contact with supercritical processing solution in which an organic matter is dissolved; accuracy, sensitivity | NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) | 2011-09-27 | — | — | US | disclosed |
| US-20080124648-A1 | Resist Pattern Forming Method, Supercritical Processing Solution For Lithography Process, And Antireflection Film Forming Method | NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) | 2008-05-29 | — | — | US | disclosed |
| US-6869742-B2 | Positive photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-03-22 | — | — | US | disclosed |
| US-6762005-B2 | SENSITIVITY, DEFINITION, AND STABILITY OF LATENT IMAGE BEFORE DEVELOPMENT, CAN YIELD A PATTERNED RESIST THIN FILM WITH HIGH CONTRAST, INVITES LESS SCUM AND HAS SATISFACTORY THERMAL RESISTANCE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-07-13 | — | — | US | disclosed |
| US-6756178-B2 | NOVOLAK RESIN CONTAINING AT LEAST 20% BY MOLE OF A M-CRESOL REPEATING UNIT AND HAVING A 1- ETHOXYETHYL GROUP SUBSTITUTING FOR PART OF HYDROGEN ATOMS OF PHENOLIC HYDROXYL GROUPS, (B) A QUINONEDIAZIDE ESTER OF, AND (C) 1,1-BIS(4-HYDROXYPHENYL) | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-29 | — | — | US | disclosed |
| US-6680155-B2 | Positive photoresist composition | TOKYO, OHKA KOGYO CO., LTD. (JP) | 2004-01-20 | — | — | US | disclosed |
| US-6620978-B2 | Esterification of a quinonediazide compound; photosensitizer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-09-16 | — | — | US | disclosed |
| US-20020061458-A1 | Positive photoresist composition | TOKYO OHKA KOGYO CO., LTD. | 2002-05-23 | — | — | US | disclosed |
| US-6312863-B1 | ALKALI-SOLUBLE RESIN; PHOTOSENSITIZER COMPRISING AN ESTER OF A 1,2-NAPHTHOQUINONEDIAZIDESULFONYL COMPOUND WITH A SUBSTITUTED M-BIS(HYDROXYBENZYL)PHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-6127087-A | COMPOSITION COMPRISING ALKALI-SOLUBLE RESIN, SPECIFIED QUINONEDIAZIDE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-10-03 | — | — | US | disclosed |
| US-6120969-A | PHENOLIC RESINS FOR PHOTORESISTS | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-09-19 | — | — | US | disclosed |
| US-6106994-A | ESTERIFYING A POLYPHENOL COMPOUND AND NAPHTHOQUINONE-1,2-DIAZIDESULFONYL HALIDE IN THE PRESENCE OF FOR EXAMPLE MONOMETHYLDICYCLOHEXYLAMINE, AND POSITIVE PHOTOSENSITIVE COMPOSITION CONTAINS RESULTANT ESTER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-08-22 | — | — | US | disclosed |
| US-6083657-A | PHENOL-FORMALDEHYDE RESIN AND QUINONEDIAZIDE COMPOUND; SEMICONDUCTORS, INTEGRATED CIRCUITS | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-07-04 | — | — | US | disclosed |
| US-5853948-A | Positive photoresist compositions and multilayer resist materials using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-12-29 | — | — | US | disclosed |
| US-5738968-A | Positive photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-04-14 | — | — | US | disclosed |
| JP-H09319083-A | POSITIVE PHOTORESIST COMPOSITION | TOKYO OHKA KOGYO CO LTD | 1997-12-12 | — | — | JP | disclosed |
| JP-H09319078-A | POSITIVE PHOTORESIST COMPOSITION | TOKYO OHKA KOGYO CO LTD | 1997-12-12 | — | — | JP | disclosed |