SCHEMBL23908692

SCHEMBL23908692

C[Si](C)(CCCCC(=O)O)O[Si](C)(C)CCCCC(=O)O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.50
TSHR P16473 6/20 0.48
NFKB1 P19838 1/20 0.48
PMP22 Q01453 1/20 0.48
AKR1B1 P15121 1/20 0.46
ALDH1A1 P00352 3/20 0.45
GPR84 Q9NQS5 7/20 0.44
PPARG P37231 7/20 0.44
PPARD Q03181 7/20 0.44
PPARA Q07869 7/20 0.44
HDAC11 Q96DB2 5/20 0.44
PTPN1 P18031 3/20 0.44
TLR2 O60603 2/20 0.44
TDP1 Q9NUW8 2/20 0.44
FABP4 P15090 2/20 0.44
SLC22A6 Q4U2R8 2/20 0.44
SLC22A8 Q8TCC7 1/20 0.44
MEN1 O00255 1/20 0.44
ESR1 P03372 1/20 0.44
ALOX15 P16050 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1054764 0.98 TSHR (0.52) LMNATSHRNFKB1PMP22ALDH1A1
Azelaic Acid SCHEMBL8198302 0.93 TSHR (0.52) LMNATSHRNFKB1PMP22ALDH1A1
SCHEMBL512941 0.93 TSHR (0.48) LMNATSHRNFKB1PMP22AKR1B1
SCHEMBL8674170 0.91 LMNA (0.46) LMNATSHRNFKB1PMP22AKR1B1
Hydrochloric Acid SCHEMBL5368847 0.91 TSHR (0.46) LMNATSHRNFKB1PMP22AKR1B1
Hydrochloric Acid SCHEMBL7534254 0.91 TSHR (0.46) LMNATSHRNFKB1PMP22AKR1B1
SCHEMBL17035392 0.90 TSHR (0.44) LMNATSHRNFKB1PMP22ALDH1A1
SCHEMBL23860276 0.90 TSHR (0.48) LMNATSHRNFKB1PMP22ALDH1A1
SCHEMBL13042886 0.86 LMNA (0.41) LMNATSHRNFKB1PMP22AKR1B1
SCHEMBL19700255 0.85 TSHR (0.43) LMNATSHRNFKB1PMP22ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 CN disclosed
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
EP-3896114-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component BRIX1, RBX1, HAX1 LMNA 2303/4885TSHR 1518/4885NFKB1 4045/4885
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT BRIX1, HAX1, RBX1 LMNA 2384/4885TSHR 1581/4885NFKB1 3981/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.