SCHEMBL23908712

SCHEMBL23908712

O=C(O)c1c(Cl)cccc1-c1cccc(Cl)c1C(=O)O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.58
DPP4 P27487 1/20 0.54
TSHR P16473 1/20 0.52
PBRM1 Q86U86 1/20 0.52
FEN1 P39748 1/20 0.50
FABP3 P05413 1/20 0.49
FABP4 P15090 1/20 0.49
CA12 O43570 1/20 0.48
CA1 P00915 1/20 0.48
CA2 P00918 1/20 0.48
CA7 P43166 1/20 0.48
CA9 Q16790 1/20 0.48
CA14 Q9ULX7 1/20 0.48
KDM4E B2RXH2 2/20 0.47
HSD17B10 Q99714 1/20 0.47
AKR1B1 P15121 1/20 0.46
KMT2A Q03164 3/20 0.46
APAF1 O14727 1/20 0.46
TDP2 O95551 1/20 0.46
NSD2 O96028 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL80183 0.90 ALDH1A1 (0.64) ALDH1A1DPP4TSHRPBRM1FEN1
SCHEMBL31212990 0.89 CYP2A6 (0.56) ALDH1A1DPP4TSHRPBRM1FEN1
SCHEMBL2136910 0.89 CYP2A6 (0.56) ALDH1A1DPP4TSHRPBRM1FEN1
SCHEMBL1514599 0.88 FABP3 (0.51) ALDH1A1DPP4TSHRPBRM1FEN1
Hydrochloric Acid SCHEMBL8042412 0.87 ALDH1A1 (0.61) ALDH1A1DPP4TSHRPBRM1FEN1
SCHEMBL7425018 0.87 ALDH1A1 (0.61) ALDH1A1DPP4TSHRPBRM1FEN1
SCHEMBL1041643 0.87 ALDH1A1 (0.61) ALDH1A1DPP4TSHRPBRM1FEN1
SCHEMBL23354090 0.86 ANO1 (0.57) ALDH1A1DPP4TSHRPBRM1FABP3
SCHEMBL23354313 0.83 KMT2A (0.50) ALDH1A1DPP4PBRM1FABP3FABP4
SCHEMBL2553214 0.83 PBRM1 (0.44) ALDH1A1DPP4TSHRPBRM1FEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
EP-3896114-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component BRIX1, RBX1, HAX1 ALDH1A1 3045/4885DPP4 4742/4885TSHR 1518/4885
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT BRIX1, HAX1, RBX1 ALDH1A1 2917/4885DPP4 4741/4885TSHR 1581/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.