SCHEMBL23909524

SCHEMBL23909524

Cc1ccc2cc(C(=O)Cl)ccc2c1C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.41
CYP1A2 P05177 3/20 0.41
HPGD P15428 2/20 0.41
KDM4E B2RXH2 2/20 0.41
CYP2C19 P33261 2/20 0.41
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
GLA P06280 1/20 0.41
HSD17B10 Q99714 1/20 0.41
PTPN1 P18031 1/20 0.39
MAPT P10636 1/20 0.39
SMN1; SMN2 Q16637 2/20 0.38
MAPK1 P28482 1/20 0.38
IKBKB O14920 1/20 0.37
LCK P06239 1/20 0.36
TSHR P16473 1/20 0.35
CYP2A6 P11509 2/20 0.35
CYP3A4 P08684 1/20 0.35
CYP2C8 P10632 1/20 0.35
CYP2D6 P10635 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909573 0.89 ALDH1A1 (0.39) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL11591905 0.88 PTPN1 (0.50) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL23909564 0.84 LCK (0.46) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL23630423 0.82 PTPN1 (0.47) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL8707349 0.81 ALDH1A1 (0.45) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL931068 0.80 ALDH1A1 (0.52) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL2750024 0.78 KDM4E (0.44) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL23909563 0.77 PTPN1 (0.46) ALDH1A1HPGDKDM4EHSD17B10PTPN1
SCHEMBL10424447 0.77 KDM4E (0.59) ALDH1A1CYP1A2HPGDKDM4ECYP2C19
SCHEMBL9622132 0.77 KDM4E (0.51) ALDH1A1CYP1A2HPGDKDM4ECYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed