SCHEMBL23909564

SCHEMBL23909564

Cc1ccc2cc(C(N)=O)ccc2c1C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LCK P06239 1/20 0.46
PLAU P00749 2/20 0.42
ALDH1A1 P00352 4/20 0.41
KDM4E B2RXH2 4/20 0.41
HPGD P15428 2/20 0.41
HSD17B10 Q99714 2/20 0.41
GLA P06280 2/20 0.41
MEN1 O00255 2/20 0.41
CYP1A2 P05177 2/20 0.41
KMT2A Q03164 2/20 0.41
CYP2C19 P33261 1/20 0.41
PARP1 P09874 1/20 0.40
PTPN1 P18031 1/20 0.39
MAPT P10636 1/20 0.39
BRD4 O60885 1/20 0.38
BRPF1 P55201 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
ERN1 O75460 1/20 0.38
GRM1 Q13255 2/20 0.37
TDP1 Q9NUW8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909600 0.89 LCK (0.43) LCKPLAUALDH1A1KDM4EHSD17B10
SCHEMBL11591905 0.88 PTPN1 (0.50) ALDH1A1KDM4EHPGDHSD17B10GLA
SCHEMBL23909524 0.84 ALDH1A1 (0.41) LCKALDH1A1KDM4EHPGDHSD17B10
SCHEMBL8707349 0.81 ALDH1A1 (0.45) ALDH1A1KDM4EHPGDHSD17B10GLA
SCHEMBL2747254 0.80 ALDH1A1 (0.43) PLAUALDH1A1KDM4EHPGDHSD17B10
SCHEMBL931068 0.80 ALDH1A1 (0.52) ALDH1A1KDM4EHPGDHSD17B10GLA
SCHEMBL2750024 0.78 KDM4E (0.44) ALDH1A1KDM4EHPGDHSD17B10GLA
SCHEMBL10424447 0.77 KDM4E (0.59) PLAUALDH1A1KDM4EHPGDHSD17B10
SCHEMBL9622132 0.77 KDM4E (0.51) ALDH1A1KDM4EHPGDHSD17B10MEN1
SCHEMBL9622665 0.77 SRD5A2 (0.54) ALDH1A1MEN1KMT2ASMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed