SCHEMBL23909573

SCHEMBL23909573

Cc1ccc2ccc(C(=O)Cl)cc2c1C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
MAPK1 P28482 1/20 0.39
PLA2G2D Q9UNK4 1/20 0.38
TSHR P16473 1/20 0.36
CES2 O00748 1/20 0.35
CES1 P23141 1/20 0.35
KDM4E B2RXH2 3/20 0.35
HPGD P15428 3/20 0.35
THRB P10828 1/20 0.35
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
CYP1A2 P05177 1/20 0.34
GLA P06280 1/20 0.34
CYP2C19 P33261 1/20 0.34
HSD17B10 Q99714 1/20 0.34
TDP1 Q9NUW8 2/20 0.34
LDHA P00338 1/20 0.34
LDHB P07195 1/20 0.34
GRIN2D O15399 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909524 0.89 ALDH1A1 (0.41) ALDH1A1SMN1; SMN2MAPK1TSHRCES2
SCHEMBL23909600 0.83 LCK (0.43) ALDH1A1SMN1; SMN2PLA2G2DTSHRKDM4E
SCHEMBL7144236 0.79 LDHA (0.50) ALDH1A1SMN1; SMN2MAPK1KDM4EHPGD
SCHEMBL23909548 0.77 ACE2 (0.40) ALDH1A1SMN1; SMN2PLA2G2DTSHRKDM4E
SCHEMBL11591905 0.76 PTPN1 (0.50) ALDH1A1SMN1; SMN2TSHRKDM4EHPGD
SCHEMBL20669903 0.76 DHODH (0.47) ALDH1A1
SCHEMBL23909517 0.74 ALDH1A1 (0.37) ALDH1A1SMN1; SMN2MAPK1KDM4EHPGD
SCHEMBL8681008 0.74 CYP2A6 (0.46) ALDH1A1SMN1; SMN2KDM4EHPGDMEN1
SCHEMBL224932 0.73 HPGD (0.59) ALDH1A1TSHRKDM4EHPGDMEN1
SCHEMBL1546802 0.72 ALDH1A1 (0.58) ALDH1A1TSHRKDM4EHPGDMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed