SCHEMBL23909563

SCHEMBL23909563

Cc1c(C(=O)O)ccc2cc(C(=O)Cl)ccc12

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN1 P18031 1/20 0.46
ALDH1A1 P00352 3/20 0.39
HPGD P15428 2/20 0.39
MAPT P10636 1/20 0.39
ACE2 Q9BYF1 2/20 0.39
MYC P01106 1/20 0.37
KDM4E B2RXH2 2/20 0.37
PPARA Q07869 1/20 0.36
LCK P06239 2/20 0.36
MPL P40238 1/20 0.35
PTGER4 P35408 1/20 0.35
IKBKB O14920 1/20 0.35
WDR5 P61964 1/20 0.35
LDHA P00338 1/20 0.34
CDC25A P30304 1/20 0.34
CDC25B P30305 1/20 0.34
HSD17B10 Q99714 1/20 0.34
GABRP O00591 1/20 0.34
GABRD O14764 1/20 0.34
GABRA1 P14867 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909548 0.89 ACE2 (0.40) PTPN1ALDH1A1HPGDACE2MYC
SCHEMBL2749203 0.88 PTPN1 (0.59) PTPN1ALDH1A1HPGDMAPTACE2
SCHEMBL23630423 0.82 PTPN1 (0.47) PTPN1ALDH1A1HPGDMAPTACE2
SCHEMBL4137339 0.78 CA12 (0.50) PTPN1ALDH1A1MAPTMYCLCK
SCHEMBL23909524 0.77 ALDH1A1 (0.41) PTPN1ALDH1A1HPGDMAPTKDM4E
SCHEMBL3374921 0.77 ALDH1A1 (0.49) ALDH1A1MAPTMYCCDC25ACDC25B
SCHEMBL2354671 0.77 RXFP1 (0.51) ALDH1A1HPGDMAPTMYCKDM4E
SCHEMBL23909551 0.75 LMNA (0.40) PTPN1ALDH1A1HPGDKDM4EPPARA
SCHEMBL10826706 0.75 ALDH1A1 (0.39) PTPN1ALDH1A1HPGDMAPTKDM4E
SCHEMBL7603252 0.75 ALDH1A1 (0.39) PTPN1ALDH1A1HPGDMAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed