SCHEMBL23909533

SCHEMBL23909533

O=[N+]([O-])c1ccc2cc(S(=O)(=O)Cl)ccc2c1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.46
HTT P42858 1/20 0.46
KMT2A Q03164 1/20 0.46
CA2 P00918 8/20 0.46
CA1 P00915 7/20 0.46
CA9 Q16790 5/20 0.46
CA12 O43570 4/20 0.46
CA5A P35218 3/20 0.46
CA14 Q9ULX7 3/20 0.46
CA3 P07451 2/20 0.46
CA4 P22748 2/20 0.46
CA6 P23280 2/20 0.46
CA7 P43166 2/20 0.46
CA13 Q8N1Q1 2/20 0.46
CA5B Q9Y2D0 2/20 0.46
HSD17B10 Q99714 1/20 0.46
PTPRC P08575 1/20 0.44
S100A4 P26447 1/20 0.44
TSHR P16473 2/20 0.42
LMNA P02545 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909603 0.95 GAA (0.44) GAAHTTKMT2ACA2CA1
SCHEMBL28122579 0.82 TSHR (0.59) GAAHSD17B10PTPRCS100A4TSHR
SCHEMBL2263563 0.82 LMNA (0.48) CA2CA1CA9HSD17B10TSHR
SCHEMBL30357699 0.82 LMNA (0.48) CA2CA1CA9HSD17B10TSHR
SCHEMBL23909541 0.81 CA2 (0.66) CA2CA1CA9CA12CA5A
SCHEMBL17673 0.80 CA2 (0.61) CA2CA1CA9CA12CA5A
SCHEMBL58443 0.79 KMT2A (0.72) GAAHTTKMT2ACA2CA1
Hydrochloric Acid SCHEMBL7567770 0.78 CA2 (0.59) CA2CA1CA9CA12CA5A
Hydrochloric Acid SCHEMBL7569229 0.78 KMT2A (0.70) GAAHTTKMT2ACA2CA1
Hydrochloric Acid SCHEMBL7569226 0.78 KMT2A (0.70) GAAHTTKMT2ACA2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed