SCHEMBL23909541

SCHEMBL23909541

NS(=O)(=O)c1ccc2cc([N+](=O)[O-])ccc2c1

nearest known ligand 0.66

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CA2 P00918 16/20 0.66
CA5A P35218 3/20 0.66
CA1 P00915 14/20 0.66
CA9 Q16790 13/20 0.66
CA12 O43570 10/20 0.66
CA14 Q9ULX7 4/20 0.66
CA13 Q8N1Q1 3/20 0.66
CA7 P43166 2/20 0.66
CA3 P07451 1/20 0.66
CA4 P22748 1/20 0.66
CA6 P23280 1/20 0.66
CA5B Q9Y2D0 1/20 0.66
LMNA P02545 1/20 0.58
VCAM1 P19320 1/20 0.50
MAPT P10636 1/20 0.48
RAB9A P51151 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909577 0.95 CA2 (0.64) CA2CA5ACA1CA9CA12
SCHEMBL28122579 0.82 TSHR (0.59) LMNAMAPT
SCHEMBL9839080 0.82 LMNA (0.82) CA2CA5ACA1CA9CA12
SCHEMBL23909533 0.81 GAA (0.46) CA2CA5ACA1CA9CA12
SCHEMBL243443 0.80 CA2 (1.00) CA2CA5ACA1CA9CA12
SCHEMBL31527763 0.80 CA2 (1.00) CA2CA5ACA1CA9CA12
SCHEMBL189037 0.79 CA2 (1.00) CA2CA5ACA1CA9CA12
SCHEMBL31527772 0.79 CA2 (1.00) CA2CA5ACA1CA9CA12
SCHEMBL6400928 0.79 CA2 (1.00) CA2CA5ACA1CA9CA12
Iodide SCHEMBL28544135 0.78 CA2 (0.95) CA2CA5ACA1CA9CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed