SCHEMBL23909535

SCHEMBL23909535

Cc1c(C(=O)O)ccc2cccc(C(=O)Cl)c12

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.49
KMT2A Q03164 4/20 0.49
HSD17B10 Q99714 3/20 0.49
TSHR P16473 3/20 0.49
ALDH1A1 P00352 3/20 0.49
KDM4E B2RXH2 2/20 0.49
RXFP1 Q9HBX9 1/20 0.49
NR4A1 P22736 1/20 0.42
NR4A2 P43354 1/20 0.42
NR4A3 Q92570 1/20 0.42
HPGD P15428 2/20 0.41
WDR5 P61964 1/20 0.40
CYP1A2 P05177 3/20 0.39
LMNA P02545 2/20 0.39
CYP3A4 P08684 2/20 0.39
CYP2C9 P11712 2/20 0.39
PTGS2 P35354 2/20 0.39
AKR1C3 P42330 2/20 0.39
HIF1A Q16665 2/20 0.39
USP2 O75604 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909554 0.83 PARP1 (0.49) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL14637413 0.80 TSHR (0.52) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL4607896 0.80 HSD17B10 (0.48) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL8679628 0.79 ALDH1A1 (0.40) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL23909552 0.79 HSD17B10 (0.43) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL1791928 0.78 HSD17B10 (0.50) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL29868398 0.78 HSD17B10 (0.50) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL11729423 0.77 ALDH1A1 (0.42) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL23909561 0.76 HSD17B10 (0.45) MEN1KMT2AHSD17B10TSHRALDH1A1
SCHEMBL23909590 0.75 TSHR (0.44) MEN1KMT2AHSD17B10TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed