SCHEMBL23909561

SCHEMBL23909561

Cc1c(C(=O)O)ccc2cccc(S(=O)(=O)Cl)c12

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 4/20 0.45
KDM4E B2RXH2 4/20 0.45
ALDH1A1 P00352 4/20 0.45
MEN1 O00255 3/20 0.45
KMT2A Q03164 3/20 0.45
TSHR P16473 2/20 0.45
RXFP1 Q9HBX9 1/20 0.45
ALOX15 P16050 1/20 0.38
WDR5 P61964 1/20 0.37
PFKFB3 Q16875 1/20 0.36
USP2 O75604 1/20 0.36
POLB P06746 1/20 0.36
CASP1 P29466 1/20 0.36
CASP7 P55210 1/20 0.36
LDHA P00338 1/20 0.36
F2 P00734 2/20 0.36
PRSS1 P07477 2/20 0.36
PRSS2 P07478 2/20 0.36
PRSS3 P35030 2/20 0.36
CYP1A2 P05177 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28656256 0.88 KMT2A (0.36) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL1586444 0.80 ALOX15 (0.49) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL23909529 0.79 MEN1 (0.38) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL23909589 0.77 EDNRA (0.42) HSD17B10KDM4EALDH1A1TSHRALOX15
SCHEMBL23909535 0.76 MEN1 (0.49) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL23909554 0.73 PARP1 (0.49) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL6042813 0.72 ALDH1A1 (0.42) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL30362324 0.71 CA1 (0.51) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL23909531 0.71 CA1 (0.51) HSD17B10KDM4EALDH1A1MEN1KMT2A
SCHEMBL135801 0.69 CA1 (0.60) HSD17B10KDM4EALDH1A1TSHRALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed