SCHEMBL23909554

SCHEMBL23909554

Cc1c(C(=O)O)ccc2cccc(C(N)=O)c12

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP1 P09874 6/20 0.49
HSD17B10 Q99714 4/20 0.49
TSHR P16473 2/20 0.46
KDM4E B2RXH2 4/20 0.45
ALDH1A1 P00352 3/20 0.45
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
RXFP1 Q9HBX9 1/20 0.45
NR4A1 P22736 1/20 0.42
NR4A2 P43354 1/20 0.42
NR4A3 Q92570 1/20 0.42
MYC P01106 1/20 0.41
GAA P10253 1/20 0.41
HPGD P15428 1/20 0.41
NPC1 O15118 1/20 0.40
CASP3 P42574 1/20 0.40
RAB9A P51151 1/20 0.40
SENP8 Q96LD8 1/20 0.40
SENP7 Q9BQF6 1/20 0.40
SENP6 Q9GZR1 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909535 0.83 MEN1 (0.49) HSD17B10TSHRKDM4EALDH1A1MEN1
SCHEMBL28163000 0.82 HSD17B10 (0.64) PARP1HSD17B10TSHRKDM4EALDH1A1
SCHEMBL1353024 0.82 HSD17B10 (0.64) PARP1HSD17B10TSHRKDM4EALDH1A1
SCHEMBL2431512 0.80 TSHR (0.52) PARP1HSD17B10TSHRKDM4EALDH1A1
SCHEMBL23909565 0.79 PARP1 (0.47) PARP1HSD17B10TSHRKDM4EALDH1A1
SCHEMBL157601 0.78 KDM4E (0.55) PARP1HSD17B10TSHRKDM4EALDH1A1
SCHEMBL28088886 0.77 NR4A1 (0.65) PARP1KDM4EALDH1A1MEN1KMT2A
SCHEMBL14837758 0.76 KDM4E (0.53) PARP1HSD17B10TSHRKDM4EALDH1A1
SCHEMBL29625222 0.76 CYP1A2 (0.46) HSD17B10TSHRKDM4EALDH1A1MEN1
SCHEMBL23909581 0.75 KMT2A (0.47) PARP1HSD17B10TSHRKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed