SCHEMBL23909552

SCHEMBL23909552

Cc1ccc2cccc(C(=O)Cl)c2c1C(=O)O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 5/20 0.43
ALDH1A1 P00352 8/20 0.41
KDM4E B2RXH2 4/20 0.41
KMT2A Q03164 3/20 0.41
MEN1 O00255 2/20 0.41
TSHR P16473 2/20 0.41
RXFP1 Q9HBX9 1/20 0.41
HPGD P15428 3/20 0.40
TDP1 Q9NUW8 3/20 0.38
L3MBTL1 Q9Y468 2/20 0.38
CYP3A4 P08684 2/20 0.38
CYP2C9 P11712 1/20 0.38
NR4A1 P22736 1/20 0.37
NR4A2 P43354 1/20 0.37
NR4A3 Q92570 1/20 0.37
MYC P01106 1/20 0.37
CDC25B P30305 1/20 0.37
MAPT P10636 1/20 0.36
DHODH Q02127 1/20 0.35
ALOX15 P16050 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7181510 0.88 HSD17B10 (0.56) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL23909565 0.84 PARP1 (0.47) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL11729423 0.79 ALDH1A1 (0.42) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL23909535 0.79 MEN1 (0.49) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL4607896 0.78 HSD17B10 (0.48) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL7144245 0.78 TDP1 (0.46) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL29868398 0.76 HSD17B10 (0.50) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL1791928 0.76 HSD17B10 (0.50) HSD17B10ALDH1A1KDM4EKMT2AMEN1
SCHEMBL23909534 0.75 ALDH1A1 (0.41) HSD17B10ALDH1A1KDM4EKMT2AHPGD
SCHEMBL29093194 0.75 HSD17B10 (0.49) HSD17B10ALDH1A1KDM4EKMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed