SCHEMBL23909547

SCHEMBL23909547

N#Cc1cccc2cc(S(N)(=O)=O)ccc12

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.51
CA2 P00918 9/20 0.46
CA1 P00915 8/20 0.46
HTT P42858 1/20 0.42
CA9 Q16790 7/20 0.42
CA12 O43570 6/20 0.42
CA13 Q8N1Q1 1/20 0.42
IKBKB O14920 1/20 0.41
CHUK O15111 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
CCNA2 P20248 1/20 0.41
CDK2 P24941 1/20 0.41
CCNA1 P78396 1/20 0.41
CA14 Q9ULX7 2/20 0.41
CA4 P22748 1/20 0.41
IDO1 P14902 1/20 0.40
ALDH1A1 P00352 1/20 0.40
GAA P10253 1/20 0.40
MAPT P10636 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14059011 0.87 LMNA (0.51) LMNACA2CA1CA9CA12
SCHEMBL23909520 0.84 HTT (0.42) CA2CA1HTTMEN1KMT2A
SCHEMBL8492756 0.84 CASP6 (0.51) CA2CA1HTTMEN1KMT2A
SCHEMBL3086429 0.81 CA1 (0.42) LMNACA2CA1HTTALDH1A1
SCHEMBL13147933 0.78 HTR6 (0.47)
SCHEMBL15010735 0.77 CYP2C9 (0.51) LMNAHTTCA9CA12MEN1
SCHEMBL1807955 0.76 LMNA (0.58) LMNACA2CA1CA9CA12
SCHEMBL6333718 0.76 LMNA (0.58) LMNACA2CA1CA9CA12
SCHEMBL8691420 0.75 LMNA (0.56) LMNACA2CA1CA9CA12
SCHEMBL1803427 0.75 LMNA (0.56) LMNACA2CA1CA9CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed