SCHEMBL23909520

SCHEMBL23909520

N#Cc1cccc2cc(S(=O)(=O)Cl)ccc12

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 1/20 0.42
CA1 P00915 3/20 0.41
CA2 P00918 3/20 0.41
GRM4 Q14833 1/20 0.38
PTGES O14684 2/20 0.37
CASP6 P55212 1/20 0.35
SLC22A12 Q96S37 2/20 0.35
CYP1A2 P05177 2/20 0.35
CYP3A4 P08684 2/20 0.35
CYP2D6 P10635 2/20 0.35
CYP2C9 P11712 2/20 0.35
CYP2C19 P33261 2/20 0.35
ALDH1A1 P00352 2/20 0.34
HSD17B10 Q99714 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
MAPT P10636 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
MEN1 O00255 1/20 0.34
TP53 P04637 1/20 0.34
KMT2A Q03164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909540 0.87 CA1 (0.45) HTTCA1CA2PTGESSLC22A12
SCHEMBL23909547 0.84 LMNA (0.51) HTTCA1CA2ALDH1A1MAPT
SCHEMBL8492756 0.84 CASP6 (0.51) HTTCA1CA2GRM4PTGES
SCHEMBL3086429 0.81 CA1 (0.42) HTTCA1CA2ALDH1A1MAPT
SCHEMBL13147933 0.78 HTR6 (0.47) SCN9A
SCHEMBL15010735 0.77 CYP2C9 (0.51) HTTCYP2C9CYP2C19ALDH1A1HSD17B10
SCHEMBL19414339 0.76 HSD17B10 (0.39) CASP6CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL1705568 0.76 CYP1A2 (0.54) CASP6CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL9418644 0.76 HTR6 (0.41) CA1CA2CASP6CYP1A2CYP3A4
SCHEMBL4311014 0.75 HSD17B10 (0.51) CASP6CYP1A2CYP3A4CYP2D6CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed